Patents Assigned to Sapporo Electroplating Industrial, Co., Ltd.
  • Method for forming Re alloy coating film having high-Re-content through electroplating
    Patent number: 7368048
    Abstract: Disclosed is a method for forming a high-Re-content alloy film, such as a Re-based film containing Re at 98% or more by atomic composition, or an alloy film containing Re in the range of 65 to less than 98% by atomic composition and at least one of Ni, Fe and Co. The method comprises performing an electroplating process using an electroplating bath containing an aqueous solution which includes a perrhenate ion, at least one ion selected from the group consisting of Ni, Fe, Co and Cr ions, and at least one of a Li ion and a Na ion. The present invention allows a high-Re-content alloy film usable as a corrosion-resistant alloy coating for a high-temperature component or the like to be formed through an electroplating process using an aqueous solution, so as to provide heat/corrosion resistances to the component, even if it has a complicated shape, in a simplified manner at a low cost.
    Type: Grant
    Filed: January 17, 2003
    Date of Patent: May 6, 2008
    Assignees: Japan Science and Technology Agency, Ebara Corporation, Sapporo Electroplating Industrial Co., Ltd.
    Inventors: Toshio Narita, Shigenari Hayashi, Takayuki Yoshioka, Hiroshi Yakuwa, Michiaki Souma, Michihisa Fukumoto
  • Method for forming Re-Cr alloy film through electroplating process using bath containing Cr(VI)
    Patent number: 6998035
    Abstract: Disclosed is a method for forming a Re—Cr alloy film consisting of Re in the range of 60 to 90% by atomic composition. The method comprises performing an electroplating process using an electroplating bath containing an aqueous solution which includes a perrhenate ion and a chromium (VI) ion. The present invention allows a Re—Cr alloy film usable as a corrosion-resistant alloy coating for a high-temperature component or the like to be formed through an electroplating process using an aqueous solution, so as to provide heat/corrosion resistances to the component, even if it has a complicated shape, in a simplified manner at a low cost.
    Type: Grant
    Filed: January 17, 2003
    Date of Patent: February 14, 2006
    Assignees: Japan Science And Technology Agency, Ebara Corporation, Sapporo Electroplating Industrial Co., Ltd.
    Inventors: Toshio Narita, Shigenari Hayashi, Takayuki Yoshioka, Hiroshi Yakuwa, Michiaki Souma
  • Method for forming Re—Cr alloy film or Re-based film through electroplating process
    Patent number: 6979392
    Abstract: Disclosed is a method for forming: a Re—Cr alloy film consisting of Re in the range of greater than 0 (zero) to less than 98% by atomic composition, and the remainder being Cr except inevitable impurities; a Re-based film consisting of 98% or more, by atomic composition, of Re, with the remainder being Cr and inevitable impurities; or a Re—Cr—Ni alloy film consisting of Re in the range of 50 to less than 98% by atomic composition, Cr in the range of 2 to less than 45% by atomic composition, and the remainder being Ni except inevitable impurities. The method comprises performing an electroplating process using an electroplating bath containing an aqueous solution which includes a perrhenate ion and a chromium (III) ion.
    Type: Grant
    Filed: January 17, 2003
    Date of Patent: December 27, 2005
    Assignees: Japan Science and Technology Agency, Ebara Corporation, Sapporo Electroplating Industrial, Co., Ltd.
    Inventors: Toshio Narita, Shigenari Hayashi, Takayuki Yoshioka, Hiroshi Yakuwa, Michiaki Souma