Patents Assigned to Sasmsung Electronics Co., Ltd.
  • SOLDER ALLOY, SOLDER PASTE, SOLDER BALL, SOLDER JOINT, AND ELECTRONIC DEVICE INCLUDING SOLDER JOINT
    Publication number: 20260042175
    Abstract: Disclosed is a solder alloy having a relatively low melting point and excellent impact resistance without containing Pb. The solder alloy may contain 14-22 mass % of Bi and 16-24 mass % of In, with the remainder comprising Sn and inevitable impurities.
    Type: Application
    Filed: October 17, 2025
    Publication date: February 12, 2026
    Applicants: SASMSUNG ELECTRONICS CO., LTD., RESEARCH BUSINESS FOUNDATION SUNGKYUNKWAN UNIVERSITY
    Inventors: Jongbum LEE, Bongmin SONG, Hoojeong LEE, Byunghoon LEE, Hoon CHOI, Hyundong LEE
  • Method and apparatus for providing web service in wireless communication system
    Patent number: 9794320
    Abstract: In a wireless communication system, a mobile terminal providing a web service receives information about a web page for a web service from a mobile terminal, receives at least one embedded object included in the web page from a web server, sets a Discontinuous Reception (DRX) interval for the mobile terminal based on a size of the at least one embedded object, transmits information about the set DRX interval to the mobile terminal, and transmits the at least one embedded object to the mobile terminal at a time the set DRX interval ends.
    Type: Grant
    Filed: November 8, 2013
    Date of Patent: October 17, 2017
    Assignee: Sasmsung Electronics Co., Ltd.
    Inventors: Chul-Ki Lee, Sang-Jun Moon, Yong-Seok Park