Abstract: Disclosed is a laser machining apparatus comprising a workpiece fixture for fastening a workpiece, a first laser removing device for machining a workpiece using first operating parameters, and a second laser removing device which can machine a workpiece using second operating parameters that are different from the first operating parameters, especially regarding the quality and quantity.

Abstract: A connecting piece for a tool of a multi-axis machining center has a support on the machining center side, a holder at the tool side and a pushing device which elastically pushes the holder into a defined position against the support. The pushing force of the pushing device can be varied during the operation of the machining center.

Abstract: During the production of a swage in a workpiece in which material is removed in layers by means of a laser beam the side walls of the swage are processed by means of a laser beam and/or a processing means and/or ultrasonic waves.

Abstract: A method for workpiece levelling includes mounting the workpiece in a machine tool, measuring the position of the workpiece in the mounting and determining a translatory offset xv, yv, zv and a rotatory offset ?v, ?v, ?v of the factual workpiece mounting compared to the ideal mounting from the measurement results and from a workpiece data forming an initial data set related to the ideal mounting, wherein for obtaining another initial data set a plurality of surface points of the mounted workpiece are measured in their position xn, yn, zn in space, the data of one of the initial data sets are varied a plurality of times in accordance with plural translatory and rotatory displacements for obtaining a plurality of varied data sets, from the varied data sets and their base data set the one data set is determined that represents a surface with a lowest deviation measure compared to a surface represented by the other of the initial data sets, and the translatory offset xv, yv, zv and the rotatory offset ?v, ?v, ?v

Abstract: In a method for machining a workpiece, a laser beam (5) is guided across the workpiece surface by means of a beam guide (2, 51), wherein the laser beam guide comprises a first guide (2) effecting a laser beam guide at a first path speed. The laser beam guide comprises a second guide (51) simultaneously operating with the first guide, which effects a laser beam guide at a second path speed, which is higher than the first path speed.

Abstract: The invention relates to a method for machining a workpiece by means of a laser beam, wherein a laser beam is guided by a beam guiding device over the surface of the workpiece within a working window. The beam guiding device and the workpiece are arranged in such a way that they are movable relative to one another in a direction of displacement along a displacement section and that they can occupy a first and a second relative working position to one another. According to the invention, a point on the workpiece can be machined from the second relative working position, said point being located behind the point which is machined from the first relative working position when viewed in the direction of displacement.

Abstract: Disclosed is a laser machining apparatus comprising a workpiece fixture (10) for fastening a workpiece (1), a first laser removing device (11) for machining a workpiece using first operating parameters, and a second laser removing device (12) which can machine a workpiece using second operating parameters that are different from the first operating parameters, especially regarding the quality and quantity.

Abstract: A support for a paint coating pad and handle. The support has a base plate for attaching to the paint coating pad. The base plate has a plurality of snap-lock support arms for receiving a shaft of the handle. A latch block having a plurality of locking grooves receives an offset section of the handle permitting the support to be attached to the handle at different working angles.