Abstract: A chip-placing method for performing an image alignment of chip placement comprises a chip pick-up step, a reference-image capturing step, an alignment-image capturing step, a calculating and processing step, a calibration adjusting step and a placing step. An image(s) of a marking member and a chip sucked by a chip-placing member is/are captured from an opposite direction so as to obtain a relative position information of the chip in relation to the marking member. An image showing the marking member and the substrate is captured from a backside so as to obtain a relative position information of the marking member in relation to the substrate. A position calibration relationship information of the position of the chip in relation to a to-be-placed location of the substrate is obtained according to those relative position information. Therefore, a relative position of the chip-placing member in relation to the to-be-placed location is calibrated.

Abstract: A chip-placing method for performing an image alignment of chip placement comprises a chip pick-up step, a reference-image capturing step, an alignment-image capturing step, a calculating and processing step, a calibration adjusting step and a placing step. An image(s) of a marking member and a chip sucked by a chip-placing member is/are captured from an opposite direction so as to obtain a relative position information of the chip in relation to the marking member. An image showing the marking member and the substrate is captured from a backside so as to obtain a relative position information of the marking member in relation to the substrate. A position calibration relationship information of the position of the chip in relation to a to-be-placed location of the substrate is obtained according to those relative position information. Therefore, a relative position of the chip-placing member in relation to the to-be-placed location is calibrated.