Patents Assigned to SB ELECTRONICS
  • Publication number: 20070084043
    Abstract: An improved electrical terminal attachment process for a wound polymer film/foil or metallized film capacitor is described that minimizes thermal damage to the capacitor structure and improves the current carrying capability of the capacitor. The process employs an electrically conductive adhesive that can be cured at low temperatures. The disclosed process improves the reliability of the capacitor when used at high RMS or pulsed currents. It also enables capacitor application structures with reduced equivalent series inductance that would be otherwise difficult or impossible to fabricate.
    Type: Application
    Filed: October 3, 2006
    Publication date: April 19, 2007
    Applicant: SB ELECTRONICS
    Inventor: Terry Hosking
  • Publication number: 20050275385
    Abstract: A wound, metallized dielectric film capacitor for pulsed power applications is disclosed. The capacitor consists of a wound metallized polymer film in the shape of a closed path ring. The electrical load is placed within the inner opening of the capacitor. The capacitor has low inductance and resistance, scales to high energy levels, and can be formed around the electrical load.
    Type: Application
    Filed: June 7, 2005
    Publication date: December 15, 2005
    Applicant: SB ELECTRONICS
    Inventor: Terry Hosking
  • Publication number: 20050157446
    Abstract: A means of increasing the corona inception voltage (CIV), and thereby increasing the operating voltage, of film/foil capacitors is described. Intentional venting of the capacitor encapsulation improves the corona inception voltage by allowing internal voids to equilibrate with the ambient environment.
    Type: Application
    Filed: December 29, 2004
    Publication date: July 21, 2005
    Applicants: FIELDMETRICS INC, SB ELECTRONICS
    Inventors: Michael Brubaker, Terry Hosking