Abstract: A wireless sensor device includes a processor connected to a wireless transmitter and at least one sensor, and a power source connected to power the processor and the wireless transmitter. The processor has two or more states. An internal control element senses at least one predetermined condition. The internal control element switches the processor between states based on the occurrence of at least one predetermined condition. A molded body encloses at least the processor, the wireless transmitter, and the internal control sensor. The internal control sensor is physically isolated within the molded body.

Abstract: A method and apparatus are provided for transmission/reception of signals between automatic test equipment (ATE) and a device under test (DUT). A probe card has a plurality of associated proximate active probe integrated circuits (APIC) connected to a plurality of probes. Each APIC interfaces with one or more test interface points on the DUT through probes. Each APIC receives and processes signals communicated between the ATE and the DUT. Low information content signals transmitted from the ATE are processed into high information content signals for transmission to the probe immediately adjacent the APIC, and high information content or time critical signals received by the APIC from the DUT are transmitted as low information content signals to the ATE. Because the APIC is immediately adjacent the probe there is minimum loss or distortion of the information in the signal from the DUT.

Abstract: An apparatus for interrogating an electronic circuit supported by a substrate includes a tester external to the substrate and comprising an tester transceiver. A testing circuit is supported by the substrate and connected to the electronic circuit. The testing circuit includes a processor and a testing circuit transceiver in communication with the tester transceiver for transmitting instructions from the tester to the processor and for transmitting results of an interrogation from the processor to the tester. The processor being programmed to process instructions from the tester to interrogate the electronic circuit with an interrogation corresponding to the instructions.

Abstract: An interconnect for transmitting an electric signal between electronic devices includes a first coupling element electromagnetically coupled to, and immediately juxtaposed to, a second coupling element. The first coupling element is mounted on and is electrically connected to a first electronic device having a first integrated circuit. The second coupling element may be mounted on and electrically connected to the first electronic device, and electrically connected to an interconnect on a second electronic device, or the second coupling element may be mounted on and electrically connected to the second electronic device.

Abstract: A wireless sensor device includes a processor connected to a wireless transmitter and at least one sensor, and a power source connected to power the processor and the wireless transmitter. The processor has two or more states. An internal control element senses at least one predetermined condition. The internal control element switches the processor between states based on the occurrence of at least one predetermined condition. A molded body encloses at least the processor, the wireless transmitter, and the internal control sensor. The internal control sensor is physically isolated within the molded body.

Abstract: An interconnect for transmitting an electric signal between electronic devices includes a first coupling element electromagnetically coupled to, and immediately juxtaposed to, a second coupling element. The first coupling element is mounted on and is electrically connected to a first electronic device having a first integrated circuit. The second coupling element may be mounted on and electrically connected to the first electronic device, and electrically connected to an interconnect on a second electronic device, or the second coupling element may be mounted on and electrically connected to the second electronic device.

Abstract: An interconnect for transmitting an electric signal between electronic devices includes a first coupling element electromagnetically coupled to, and immediately juxtaposed to, a second coupling element. The first coupling element is mounted on and is electrically connected to a first electronic device having a first integrated circuit. The second coupling element may be mounted on and electrically connected to the first electronic device, and electrically connected to an interconnect on a second electronic device, or the second coupling element may be mounted on and electrically connected to the second electronic device.

Abstract: There is provided, in combination, an integrated circuit chip, a device, and a multilayered structure mounted between the integrated circuit chip and the device. The multilayered structure has signal pathways that transfer signals between the integrated circuit chip and the device, and at least one signal pathway with a first wireless coupling element in the multilayered structure that is in communication with a second wireless coupling element in one of the integrated circuit chip, the device, and the multilayered structure.

Abstract: A thin film transistor (TFT) array having test circuitry includes a thin film transistor array body having a plurality of pixels. Test circuitry is integrally formed with the body. The test circuitry includes a power supply for supplying power via the test circuitry to the body; and a plurality of wireless switches to activate selected pixels.

Abstract: There is provided, in combination, an integrated circuit chip, a device, and a multilayered structure mounted between the integrated circuit chip and the device. The multilayered structure has signal pathways that transfer signals between the integrated circuit chip and the device, and at least one signal pathway with a first wireless coupling element in the multilayered structure that is in communication with a second wireless coupling element in one of the integrated circuit chip, the device, and the multilayered structure.

Abstract: Various embodiments are described herein for an apparatus and method for the wireless testing of Integrated Circuits and wafers. In one embodiment, the apparatus comprises a test unit external from the wafer and at least one test circuit that is fabricated on the wafer that contains the Integrated Circuit. The test unit transmits an RF signal to power the test circuit. The test circuit, comprising configurable circuitry, performs a series of parametric tests at the normal operating frequency of the Integrated Circuit and transmits the test results to the test unit for analysis.

Abstract: An interconnect for transmitting an electric signal between electronic devices includes a first coupling element electromagnetically coupled to, and immediately juxtaposed to, a second coupling element. The first coupling element is mounted on and is electrically connected to a first electronic device having a first integrated circuit. The second coupling element may be mounted on and electrically connected to the first electronic device, and electrically connected to an interconnect on a second electronic device, or the second coupling element may be mounted on and electrically connected to the second electronic device.

Abstract: An apparatus for interrogating an electronic circuit supported by a substrate includes a tester external to the substrate and comprising an tester transceiver. A testing circuit is supported by the substrate and connected to the electronic circuit. The testing circuit includes a processor and a testing circuit transceiver in communication with the tester transceiver for transmitting instructions from the tester to the processor and for transmitting results of an interrogation from the processor to the tester. The processor being programmed to process instructions from the tester to interrogate the electronic circuit with an interrogation corresponding to the instructions.

Abstract: A method and apparatus are provided for transmission/reception of signals between automatic test equipment (ATE) and a device under test (DUT). A probe card has a plurality of associated proximate active probe integrated circuits (APIC) connected to a plurality of probes. Each APIC interfaces with one or more test interface points on the DUT through probes. Each APIC receives and processes signals communicated between the ATE and the DUT. Low information content signals transmitted from the ATE are processed into high information content signals for transmission to the probe immediately adjacent the APIC, and high information content or time critical signals received by the APIC from the DUT are transmitted as low information content signals to the ATE. Because the APIC is immediately adjacent the probe there is minimum loss or distortion of the information in the signal from the DUT.

Abstract: A thin film transistor (TFT) array having test circuitry includes a thin film transistor array body having a plurality of pixels. Test circuitry is integrally formed with the body. The test circuitry includes a power supply for supplying power via the test circuitry to the body; and a plurality of wireless switches to activate selected pixels.

Abstract: A method and apparatus for interrogating an electronic component (20), includes a body (18 or 102) having an interface (10, 24, 108 or 154) for an interrogating device (48/50 or 106) to use as a conduit in reliably performing multiple discrete interrogations of the electronic component (20) without the interrogating device physically touching the electronic component (20).

Abstract: A method and apparatus for interrogating an electronic component, includes a body having an interface for an interrogating device to use as a conduit in reliably performing multiple discrete interrogations of the electronic component without the interrogating device physically touching the electronic component.

Abstract: The present invention is for an apparatus and method for the wireless testing of Integrated Circuits and wafers. The apparatus comprises a test unit external from the wafer and at least one test circuit which is fabricated on the wafer which contains the Integrated Circuit. The test unit transmits an RF signal to power the test circuit. The test circuit, comprising a variable ring oscillator, performs a series of parametric tests at the normal operating frequency of the Integrated Circuit and transmits the test results to the test unit for analysis.

Abstract: A non-contact tester for electronic circuits consists of an electronic circuit and independent scanning head, in combination. The electronic circuit includes a micro-fabricated wireless i/o cell and means for sending and receiving signals via the wireless i/o cell. The independent scanning head has a wireless i/o cell that is compatible with the wireless i/o cell on the electronic circuit. This enables data to be exchanged with the electronic circuit to confirm proper functioning of the electronic circuit.

Abstract: A non-contact tester for electronic circuits consists of an electronic circuit and independent scanning head, in combination. The electronic circuit includes a micro-fabricated wireless i/o cell and means for sending and receiving signals via the wireless i/o cell. The independent scanning head has a wireless i/o cell that is compatible with the wireless i/o cell on the electronic circuit. This enables data to be exchanged with the electronic circuit to confirm proper functioning of the electronic circuit.