Abstract: A solderable polyurethane wire enamel composition comprising a mixture of a blocked isocyanate and polyesterimide resin wherein the ratio of isocyanate groups in the blocked isocyanate to hydroxyl groups in the polyesterimide resin is about 0.82:1 to about 5.7:1 and the hydroxyl to carboxylic acid ratio of the raw materials used in preparing the polyesterimide is about 1.4:1 to about 2.5:1.

Abstract: An adhesive is disclosed for use in flexible circuitry, laminates and electrical products. The adhesive has improved flexibility and adhesive properties. It may be applied in solution form or may be cast as a free-standing film which is later heated and compressed to give adhesive properties. The adhesive comprises a phenolaldehyde resin or other phenolic resin, an epoxy resin and an elastomer.

Abstract: An adhesive is disclosed for use in flexible circuitry, laminates and electrical products. The adhesive has improved flexibility and adhesive properties. It may be applied in solution form or may be cast as a free-standing film which is later heated and compressed to give adhesive properties. The adhesive comprises a phenol-aldehyde resin or other phenolic resin, an epoxy resin and an elastomer.

Abstract: Self bondable polyamides are prepared by reacting an aromatic diisocyanate or diamine with a mixture of terephthalic acids and one or two aliphatic dibasic acid having at least 6 carbon atoms and a monocarboxylic acid. These self bondable amides can also be used as topcoats for wires having basecoats of another polymer, e.g., a polyester, polyester-imide, or polyamide-imide.

Abstract: Self-bondable polyamides are prepared by reacting an aromatic diisocyanate or diamine with a mixture of terephthalic acid and an aliphatic dibasic acid having at least 6 carbon atoms. These self-bondable amides can also be used as topcoats for wires having basecoats of another polymer, e.g. a polyester, polyester-imide, or polyamide-imide.

Abstract: Self-bondable polyamides are prepared by reacting an aromatic diisocyanate or diamine with a mixture of terephthalic acid and an aliphatic dibasic acid having at least 6 carbon atoms. These self-bondable amides can also be used as topcoats for wires having basecoats of another polymer, e.g. a polyester, polyester-imide, or polyamide-imide.

Abstract: A hydrolytically stable heat curable composition useful as a hermetic varnish for electrical conductors is provided. It consists essentially of an aqueous solution of (1) an epoxy adduct which is the reaction product of(A) a glycidyl ether of a dihydric phenol,(B) aminobenzoic acid,(C) a water soluble organic solvent boiling about 150.degree. C., and(D) a water soluble amine,and (2) a water soluble phenolic cross-linking agent.

Abstract: A hydrolytically stable heat curable composition useful as a hermetic varnish for electrical conductors is provided. It consists essentially of an aqueous solution of(1) an epoxy adduct which is the reaction product of:(A) a glycidyl ether of a dihydric phenol,(B) aminobenzoic acid,(C) a water soluble organic solvent boiling above 150.degree. C., and(D) a water soluble amine,and(2) a water soluble phenolic cross-linking agent.

Abstract: Self-bondable polyamides are prepared by reacting an aromatic diisocyanate or diamine with a mixture of terephthalic acid and an aliphatic dibasic acid having at least 6 carbon atoms. These self-bondable amides can also be used as topcoats for wires having basecoats of another polymer, e.g. a polyester, polyester-imide, or polyamideimide.

Abstract: A low molecular weight polyester-imide resin is prepared wherein there is employed as the dibasic acid either 100% of the diimide dicarboxylic prepared by reacting two moles of trimellitic anhydride with one mole of methylene dianiline (the diimide is abbreviated DID) or oxydianiline or the dibasic acid can also contain a small percent of another aromatic acid. The product is used to produce coated wires having outstanding heat shock. The product also is useful to provide a top coat to wire coated with a polyester or with another polyester-imide.

Abstract: Water dispersible oil-modified polyesters and oil-free polyesters are formed by the reaction of aromatic dicarboxylic acids, aliphatic dicarboxylic acids and polyols to form the polyester. In oil-free polyesters, oils of the respective fatty acids are excluded but the other reactants are similar to those employed in the preparation of oil-modified polyesters.

Abstract: Water soluble polyester-imide prepolymers are prepared (1) having 5 to 60%, preferably at least 35%, of imide moieties, (2) an excess hydroxyl content in excess of 60% and preferably more than 100%, and (3) a number average molecular weight of 600-1300. To water solubilize the prepolymers formed, there are added amines, preferably tertiary amines. The products are useful as wire enamels. To enhance the thermoplastic flow of the enamel, there are added organic titanates.

Abstract: The invention is directed to alkyd resin compositions which contain, in addition to the alkyd (1) a phenolic resin containing carboxyl substituents and (2) a triazine derivative or a resinous condensation product thereof. Upon heat treatment, to effect curing, the alkyd resin compositions of the invention exhibit upgraded moisture resistance, improved bond strengths and improved chemical resistance. The alkyd resin composition can be rendered water-soluble.

Abstract: Water dispersible oil-modified polyesters and oil-free polyesters are formed by the reaction of aromatic dicarboxylic acids, aliphatic dicarboxylic acids and polyols to form the polyester. In oil-free polyesters, oils of the respective fatty acids are excluded but the other reactants are similar to those employed in the preparation of oil-modified polyesters.

Abstract: Water soluble polyester-imide prepolymers are prepared (1) having 5 to 60%, preferably at least 35%, of moieties (2) an excess hydroxyl content in excess of 60% and preferably more than 100%, and (3) a number average molecular weight of 600-1300. To water solubilize the prepolymers formed, there are added amines, preferably tertiary amines. The products are useful as wire enamels. To enhance the thermoplastic flow of the enamel, there are added organic titanates.

Abstract: A method of coating conductors with polyvinyl formal dissolved in a solvent comprising certain monoalkyl ethers of diethylene glycol and triethylene glycol or the monophenyl ether of ethylene glycol, diethylene glycol, triethylene glycol, tetraethylene glycol or propylene glycol. In some cases it is necessary to have a diluent such as an aromatic hydrocarbon present.

Abstract: Water soluble polyesters are prepared by reacting an aromatic dicarboxylic acid, a diol and a triol (the molar ratio of diol to triol being 75:25 to 40:60) with or without a monohydric alcohol. The polyesters have a molecular weight of 800 to 1300, an OH/COOH ratio of 1.8:1 to 3:1. The polyesters are useful in making wire enamels.

Abstract: Polyvinyl formal dissolved in a solvent comprising certain monoalkyl ethers of diethylene glycol and triethylene glycol or the monophenyl ether of ethylene glycol, diethylene glycol, triethylene glycol, tetraethylene glycol or propylene glycol. In some cases it is necessary to have a diluent such as an aromatic hydrocarbon present.

Abstract: Polyester-imide resins are prepared which are soluble in non-phenolic solvents by incorporating a monoether of a diethylene glycol or triethylene glycol into the resin.

Abstract: Polyester-imide resins are prepared which are soluble in non-phenolic solvents by incorporating a monoether of a diethylene glycol or triethylene glycol into the resin.