Abstract: An automatic dipping machine consists of a loading platform, a carrier platform, a vacuum suction disk and a lifting means. The loading platform is a rectangular frame and has two sides mounted respectively with a turning shaft and engaged with two sides of the carrier platform for turning the carrier platform. The vacuum suction disk is located on the surface of the carrier platform and may suck and hold a carrier plate. The lifting means engages with the loading platform to drive the loading platform moving up or down. When the vacuum suction disk sucks and holds a carrier plate, the turning shaft will be turned 180 degrees to move the carrier platform and the vacuum suction disk and carrier plate facing downward, the lifting means will drive the loading platform downwards to make the chips mounted on the carrier plate to contact a silver paste tray located below the loading platform to complete dipping process.

Abstract: The present invention is directed to an apparatus for allocating passive devices before sintering, which comprises: a preparation area, which includes a frame in which trays located, a first driver and a sliding track; a loading area, which includes a vibrator; an operation area, which includes a loading material portion and a receiving portion; and an output area, which includes a collection frame and a second driver; wherein the vibrator is arranged in a position higher than that of the receiving portion; an oblique plate structure is disposed at the side of the vibrator facing to the receiving portion; a slide plate is set at the bottom surface of the oblique plate structure, thereby forming the loading material portion; a first side frame is formed at both ends of the plate oblique structure and the slide plate; and a first pressing plate is locked on the first side frame, thereby forming a gap between the bottom end of the first pressing plate and the top end of the slide plate.

Abstract: A method for coating conductive metal onto a electrode comprises a step of adhering a tape onto a first side of a tooling plate, a step of shaking electrodes to be fell into respective guiding holes of the tooling plate and to be held at first ends of the electrodes, a step of pre-pressing second ends of the electrodes in the guiding holes of the tooling plate, a step of holding the tooling plate with a vacuum holder to dip the second ends of the electrodes down into a liquid conductive metal trough, a step of re-dipping the tooling plate into the liquid conductive metal trough for modifying shapes of the first ends of the electrodes, a step of baking the second ends of the electrodes, a step of adhering another tape onto a second side of the tooling plate and removing the tape at the first ends of the electrodes, a step of pre-pressing the first ends of the electrodes, a step of holding the tooling plate with the vacuum holder to dip the first ends of the electrodes into the liquid conductive metal trough, a