Abstract: A power-electronic metal-ceramic module (10) comprising a metal-ceramic substrate (12) made of a ceramic carrier (14) having a metal top and bottom ply (16, 18), which is joined on or in the metal top ply (16) and/or the metal bottom ply (18) with a metal layer (16, 18, 22, 23) forming a frame (24) for accommodating at least one electronic component (30) and at least one electronic component (30) accommodated in the frame (24).

Abstract: A circuit board (10, 10?, 10?) includes at last one insulating substrate layer (SL1, SL2, SL3, SL4, SL5) and a plurality of electrically conductive copper coats (C1, C2, C3) arranged on the at least one insulating substrate layer (SL1, SL2, SL3, SL4, SL5), wherein at least one of the electrically conductive copper coats (C1, C2, C3) is coated at least on both sides with a layer (HSI, HS2, HS3) made of a material for inhibiting electromigration, wherein on a layer (HS1, HS2) made of a material for inhibiting electromigration a further metal layer (M1, M2, M3, M3?) is provided, which is in turn coated with a further layer (HS3, HS3?) made of a material for inhibiting electromigration.

Abstract: A method for contacting a metallic contact pad embedded in a printed circuit board layer sequence, comprising the steps of producing a first hole matrix having a plurality of holes in a surface of the printed circuit board layer sequence in order to partly expose the metallic contact pad, of applying a metal layer in order to at least partly fill the holes of the first hole matrix, of producing a second hole matrix having a plurality of holes in the surface of the printed circuit board layer sequence in order to partly expose the metallic contact pad, wherein the holes of the second hole matrix are arranged in a manner offset relative to the holes of the first hole matrix, and of applying a metal layer in order to at least partly fill the holes of the second hole matrix, and a correspondingly produced printed circuit board.

Abstract: A method for producing a radio frequency transmitting/receiving element comprising at least one radio frequency antenna and at least one radio frequency chip, and to a corresponding radio frequency transmitting/receiving element made by the method. The method comprises the following steps: providing a temporary rigid carrier; applying a conductor pattern structure comprising the antenna structure of the at least one radio frequency antenna and connection contacts—connected thereto via leads—for the at least one radio frequency chip; arranging the at least one radio frequency chip on the connection contacts of the conductor pattern structure; applying an electrically insulating layer on the conductor pattern structure, such that the at least one radio frequency chip is surrounded by the electrically insulating layer; and removing the temporary rigid carrier.

Abstract: An electronic switching element includes at least one semiconductor switch inserted into a layer sequence of a conductor structure element; and at least two busbars which are configured to contact-connect the at least one semiconductor switch, wherein the at least two busbars run substantially above one another in the layer sequence of the conductor structure element.

Abstract: A method for producing a radio-frequency antenna in a conductor structural element with an encompassing layer sequence, including: providing a rigid carrier having an underside and a top side; defining an antenna assignment section on the rigid carrier; applying at least one electrically insulating layer with a recess in such a way that the antenna assignment section is exposed; placing a radio-frequency substrate above the antenna assignment section with formation of a cavity between the rigid carrier and the radio-frequency substrate; aligning and fixing the radio-frequency substrate relative to the rigid carrier; laminating the layer construction prepared in this manner such that resin material of the at least one electrically insulating layer liquefies and encloses the radio-frequency substrate with the cavity being left free; cutting the antenna assignment section out of the rigid carrier from the outer underside (remote from the layer construction) of the rigid carrier.

Abstract: Method for producing a conductor structural element with a layer sequence having an internal layer substrate, including the steps: providing a rigid carrier having an underside and a top side; defining a cut-out section on the rigid carrier; applying at least one electrically insulating layer with a recess in such a way that the cut-out section is exposed; placing an internal layer substrate above the cut-out section with formation of a cavity between the rigid carrier and the internal layer substrate; aligning and fixing the internal layer substrate relative to the rigid carrier; laminating the layer construction prepared in this manner such that resin material of the at least one electrically insulating layer liquefies and encloses the internal layer substrate with the cavity being left free; producing a cut-out by cutting the cut-out section out of the rigid carrier from the outer underside of the rigid carrier.

Abstract: The method for manufacturing a printed circuit board element (10) having an inlay (16) and a current sensor (30) for determining a current flowing in the inlay (16), wherein, for the improvement of the positional accuracy of the inlay (16) relative to the current sensor (30), the method comprises the following steps: providing a layer (12) of printed circuit board material having a recess (14), providing an inlay (16) having an inlay outline, inserting the inlay (16) in the recess (14); embedding the inlay (16) in the recess (14); completing and laminating the layered printed circuit board structure; applying at least two alignment markings (M1, M2) on an uppermost printed circuit board layer (AL); forming a defined cross-section tapering (S) on the inlay outline, the tapering being aligned with the at least two alignment markings (M1, M2); applying an assembly marking for a current sensor (30) on an uppermost printed circuit board layer (AL), the assembly marking being aligned with the at least two alignm

Abstract: A printed circuit board element (LP) having at least one electronic switching element (12.1, 12.2, 12.3) integrated in the printed circuit board element (LP), which switching element comprises two semiconductor switches (14, 16) introduced into a layer sequence of the printed circuit board element (LP) and at least two busbars (20, 22, 24) formed to contact the semiconductor switches (14, 16), wherein the busbars (20, 22, 24) run substantially above one another in the layer sequence of the printed circuit board element (LP) and at least one intermediate circuit capacitor (C; C1, C2, C3, C4) arranged between the two busbars (20, 22) is introduced into the layer sequence of the printed circuit board element (LP).

Abstract: Electronic component having a first lead frame consisting of an electrically conductive material. The first lead frame carries a first semiconductor component. In the plane of the lead frame a shunt element is arranged, wherein the shunt element comprises a resistor body arranged between a first terminal contact and a second terminal contact. An electrically conducting connection extends from a terminal of the first semiconductor component through the first lead frame to the first terminal contact of the shunt element. A current measurement with good accuracy is facilitated.

Abstract: An electronic sub-assembly (36) comprising at least one electronic component (14) embedded in a sequence of layers, wherein the electronic component (14) is arranged in a recess of an electrically conductive central layer (16) and directly adjoins a resin layer (12, 20) on each side.

Abstract: The invention relates to an electronic device comprising a printed circuit board (14) and comprising an electronic component (16) arranged on a first surface (15) of the printed circuit board (14). The printed circuit board (14) has a cutout (23) extending from a second surface (24) of the printed circuit board (14), said second surface being situated opposite the first surface (15), in the direction of the electronic component (16). The electronic device comprises a coolant container (25), which has an opening closed by the second surface (24) of the printed circuit board (14). The invention additionally relates to a method for producing such an electronic device.

Abstract: An electronic assembly group comprising a printed circuit board structure in a multilayer configuration that has at least two electrically conductive layers. The electronic assembly group also comprises an additional passive component that is connected to the two electrically conductive layers, each of which has at least one segment that extends beyond the multilayer structure to form connection regions, the passive component making contact directly at the connection regions.

Abstract: The invention relates to an electronic component, namely a printed circuit board element comprising a first semiconductor component (14) which is arranged on an upper side of an electrically conductive intermediate plate (16) such that a connector pad (18) of the semiconductor component (14) is electrically contacted with the intermediate plate (16) and comprising a second semiconductor component (15) which is arranged on a lower side of the intermediate plate (16). The second semiconductor component (15) comprises a first connector pad (17) and a second connector pad (19), wherein both connector pads (17, 19) are aligned in the direction of the intermediate plate (16) and wherein the first connector pad (17) is contacted with the intermediate plate (16), and wherein the second connector pad (19) is not contacted with the intermediate plate (16). Moreover, the invention relates to a method for producing such a printed circuit board element.

Abstract: Electronic sub-assembly comprising a carrier layer and a mounting area with at least one electronic component, wherein the carrier layer has at least in portions a material with a low coefficient of thermal expansion to adjust the coefficient of thermal expansion of the carrier layer, and wherein at least one compensation layer is provided on the carrier layer adjacent to the installation area, on which compensation layer an electrically insulating, thermally conductive layer and at least one electrically conductive layer are provided.

Abstract: A method of producing a printed circuit board (10) with a plurality of inlays (21, 22, 23, 24), having the following steps: supplying a plurality of inlays (21, 22, 23, 24), of which at least one inlay has at least one positioning element (21.1, 21.2; 22.1 to 22.7; 23.1, 23.2; 24.1, 24.2); building up a layer sequence from a plurality of printed-circuit-board layers, with at least one recess (14) for accommodating inlays, wherein, prior to the step of the plurality of inlays (21, 22, 23, 24) being inserted, the recess (14) is defined in an uppermost layer (12) by a frame made of non-conductive printed-circuit-board material; inserting the plurality of inlays (21, 22, 23, 24) into the recess (14) defined by the frame; covering the inlays (21, 22, 23, 24) with a non-conductive printed-circuit-board material; laminating the layer sequence, and removing at least the positioning elements (21.1, 21.2; 22.1 to 22.7; 23.1, 23.2; 24.1, 24.2) which establish a conductive contact between neighboring inlays.

Abstract: A method of producing a printed circuit board (10) with a plurality of inlays (21, 22, 23, 24), having the following steps: supplying a plurality of inlays (21, 22, 23, 24), of which at least one inlay has at least one positioning element (21.1, 21.2; 22.1 to 22.7; 23.1, 23.2; 24.1, 24.2); building up a layer sequence from a plurality of printed-circuit-board layers, with at least one recess (14) for accommodating inlays, wherein, prior to the step of the plurality of inlays (21, 22, 23, 24) being inserted, the recess (14) is defined in an uppermost layer (12) by a frame made of non-conductive printed-circuit-board material; inserting the plurality of inlays (21, 22, 23, 24) into the recess (14) defined by the frame; covering the inlays (21, 22, 23, 24) with a non-conductive printed-circuit-board material; laminating the layer sequence, and removing at least the positioning elements (21.1, 21.2; 22.1 to 22.7; 23.1, 23.2; 24.1, 24.2) which establish a conductive contact between neighboring inlays.

Abstract: The present invention relates to a method for producing a conductor structural element, comprising providing a rigid substrate, electrodepositing a copper coating on the rigid substrate, applying a conductor pattern structure to the copper coating, then possibly mounting components, laminating the substrate with at least one electrically insulating layer, detaching the rigid substrate, at least partially removing the remaining copper coating of the rigid substrate in such a way that the conductor pattern structure is exposed.

Abstract: A printed circuit board multilayer construction comprising a layer stack composed of plurality of electrically insulating and/or conductive layers arranged one above another and a cavity in the interior of the layer stack, which extends laterally only in a partial region of the areal extent of the layer stack, is exposed to a pressure surrounding the printed circuit board multilayer construction through an opening provided in the layer stack and is sealed relative to ingress of liquid. Furthermore, the present invention relates to a method suitable for producing a printed circuit board multilayer construction of this type.

Abstract: An electronic device comprising an electrically conductive core layer with a first layer composed of electrically conductive material, the first layer being applied on both sides and with at least one electronic component arranged in a cutout of the first layer, wherein the first layer is covered in each case with an electrically insulating, thermally conductive layer and a further layer composed of electrically conductive material is provided in each case on the thermally conductive layer, the further layer being coated in each case with a covering layer composed of electrically conductive material, and furthermore having plated-through boles composed of the material of the covering layer, which extend through the electrically insulating, thermally conductive layer covering the electronic component and the further layer composed of electrically and thermally conductive material for the purpose of making contact with the electronic component.