Abstract: Methods and systems for reducing SWaP in combinations of laser diode drivers (LDDs) and diode laser pump modules (DPMs) are disclosed.

Abstract: Methods to minimize electro-corrosion in the water cooling ports of stacked heat sinks (coolers) and components fabricated according to those methods are disclosed.

Abstract: Methods and systems for increased heat removal from devices in which the component design allows for thinner heat removal components.

Abstract: A cooling device includes a thermally conductive object having an opening configured to receive an optical component, the opening being configured such that the optical component is thermally and optically operationally connected to the thermally conductive and electrically conductive object. One or more cooling components, microchannel coolers in one instance, are also thermally operationally connected to the thermally conductive and electrically conductive object. Methods of use are disclosed.

Abstract: Methods to minimize electro-corrosion in the water cooling ports of stacked heat sinks (coolers) and components fabricated according to those methods are disclosed.

Abstract: Systems and methods that accept the emitted radiant power from such a combined diode laser structure (laser bar stack) and efficiently direct essentially all of it into the pump cladding of a double-clad fiber amplifier, such that the radiant power will then be absorbed by a rare-earth doped core in the active fiber.

Abstract: A method and apparatus transferring high radiant power from a plurality of laser diodes into a single optical fiber with high efficiency, small size, and reduced weight.

Abstract: A method, and systems to implement the method, for reducing slow axis divergence in a laser diode bar including tailoring a power deposition profile across the emitter so as to reduce thermal gradients, thereby resulting in a substantially (nearly) uniform temperature across the width of the emitter.

Abstract: Embodiments of micro-x-ray sources and methods for obtaining a micro-x-ray source are disclosed.

Abstract: Systems and methods for providing a low stress electrode connection capable of carrying a high electrical current to an edge-emitting device, such as a laser diode are described. Systems and methods for providing mechanisms to allow precise adjustment of the relative position of one heat-sink for an optical edge emitting device relative to an adjacent heat-sink in a stack of heat-sinks are also provided herein.

Abstract: A method of attaching a semiconductor component to a heat-sink where the component is first placed onto a heat-sink substrate whose attachment surface comprises a malleable-metal film, a semiconductor component is placed onto the malleable-metal film, and pressure and heat is applied for a predetermined time to the stack including substrate with malleable-metal film and semiconductor component.

Abstract: The method of these teachings includes processing a semiconductor structure forming an active waveguide of a semiconductor laser in an environment free of contamination in order to provide contamination free mirror facets at the ends of the active waveguide, and depositing a single crystal passivation layer comprised of a semiconductor whose bandgap exceeds that of the active layer and the waveguide layers and that does not form misfit dislocations with the laser diode semiconductor, the deposition occurring at a temperature at which the semiconductor structure does not degrade.

Abstract: Image acquisition systems utilizing a pixilated transducer.

Abstract: Image acquisition systems utilizing a pixilated transducer.

Abstract: Methods for fabricating structures such as transducer pedestal structures and transducers fabricated by the methods.

Abstract: According to the invention, an apparatus for transferring heat with a target is disclosed. The apparatus may include a body which defines a surface, inlet and outlet ports, inlet and outlet manifold passages, and heat transfer passages. The surface may couple the target with the body. The inlet port may be configured to receive and direct a fluid into inlet manifold passages. The outlet port may be configured to receive and output the fluid. The inlet and outlet manifold passages may be configured to receive and direct the fluid to and from the heat transfer passages. The heat transfer passages may be configured to receive and direct all of the fluid from the inlet manifold passages in one or more directions substantially parallel to the surface and substantially perpendicular the input manifold passages. At least one heat transfer passages may have a plurality of fins on at least one surface.

Abstract: Image acquisition methods and systems utilizing a pixilated transducer.

Abstract: Methods and systems for semiconductor diode junction protection.

Abstract: Methods and apparatus for maintaining a quality of a Raman medium in a Raman conversion cell. In various examples, a flow velocity of the Raman medium is tailored based on a spatial nonuniformity of heat deposition resulting from the Raman conversion in the cell. In particular, in one example, the flow velocity of the Raman medium may be tailored to be higher where the heat deposition/temperature rise is larger and smaller elsewhere in the cell. This type of flow velocity profile reduces the overall required volumetric flow of the Raman medium in the cell without significantly affecting a quality of the Raman medium.

Abstract: Methods and systems that enable the combining of laser diodes into a laser beam.