Abstract: A liquid injection device includes a nozzle, a moving element and a control valve. The nozzle has a channel, a bypass passage and a suck back passage. The channel penetrates through the nozzle for injecting a working fluid. The channel has a liquid outlet. The bypass passage has a first opening, a switch-on position and a switch-off position. The suck back passage has a second opening between the first opening and the liquid outlet. The first opening and the second opening communicate with the channel. The moving element is disposed in the bypass passage. The control valve is disposed on the nozzle and controls the moving element to switch between the switch-on position and the switch-off position to open or close the channel. A suck back pump sucks the working fluid remaining between the first opening and the liquid outlet when the moving element is located at the switch-off position.

Abstract: This disclosure provides a wafer processing method having the following steps: providing a wafer (10), an immersion device (100), a carrier (200), and a spray device (300); turning the wafer (10) from a horizontal manner to an upright manner; upright placing the wafer (10) into the immersion device (100) for immersion; taking the wafer (10) out from the immersion device (100) and placing that onto the carrier (200) horizontally; spraying a liquid on the wafer (10) by the spray device (300); rinsing the wafer (10); rotating the carrier (200) to dry the wafer (10). Multiple steps for processing the wafer (10) may be performed on the same carrier (200) to accelerate the process.

Abstract: A wafer transfer device includes a base, a plurality of fixed rings, a rotating shaft, a turntable, an air suction pump and a driving mechanism. The fixed rings are stacked sequentially and each has a channel and a ring groove. The channel is extended from an outer periphery of the fixed ring and communicates to the ring groove. The rotating shaft is connected to each fixed ring and has a plurality of flow passages corresponding to the fixed rings and communicating to the ring groove. The turntable is fixedly connected to the rotating shaft. The air suction pump sucks each wafer, and the driving mechanism drives and rotates the turntable and the rotating shaft, so that each flow passage rotates relative to each fixed ring and keeps communicating with each ring groove to maintain the suction of each wafer.

Abstract: A substrate processing system includes a substrate processing set and a substrate holding unit. The substrate processing set includes a substrate supporting part for supporting a vertical substrate. The substrate holding unit includes two cantilevers and two substrate holding parts. Each of the substrate holding parts is respectively located on each of the cantilevers. The two substrate holding parts are used for holding the substrate vertically. When the substrate holding unit moves next to the substrate processing set and the two substrate holding parts touch the substrate, the two substrate holding parts hold the substrate.

Abstract: A cooling system for an electronic equipment enclosure employs a flat plate heat pipe to deliver heat from the interior of the enclosure through a connector to a removable external heat sink. The heat pipe includes a metallic bottom plate having a depression therein containing a set of rods evenly spaced from one another. A top plate covers the bottom plate with the rods compressed therebetween. Channels formed between adjacent rods are partially evacuated and injected with an evaporative fluid. The fluid and its vapor circulate in the channels to convey heat from a warm end of the heat pipe to a cool end. The heat sink is of similar construction.