Abstract: A cooling system for an electronic equipment enclosure employs a flat plate heat pipe to deliver heat from the interior of the enclosure through a connector to a removable external heat sink. The heat pipe includes a metallic bottom plate having a depression therein containing a set of rods evenly spaced from one another. A top plate covers the bottom plate with the rods compressed therebetween. Channels formed between adjacent rods are partially evacuated and injected with an evaporative fluid. The fluid and its vapor circulate in the channels to convey heat from a warm end of the heat pipe to a cool end. The heat sink is of similar construction.