Abstract: A non-ceramic image sensor semiconductor package with improved moisture resistance, lower cost, and higher reliability is provided. A semiconductor chip with a vision chip active area is attached to a multi-layer resin mask organic substrate. A plurality of bonding wires are attached between parts of the semiconductor chip and the multi-layer resin mask organic substrate to create selective electrical connections. A castellation is formed to create a riser surrounding the semiconductor chip. The height of the castellations can be made to a desired height so that proper clearance of the semiconductor chip and the glass window is achieved. A transparent window is placed on the top of the castellations. A liquid encapsulant is formed to protectively seal the non-ceramic image sensor semiconductor package thereby shielding the semiconductor chip and vision chip active area from the external environment.

Abstract: A non-ceramic image sensor semiconductor package with improved moisture resistance, lower cost, higher reliability, and lower profile is provided. A semiconductor chip with a vision chip active area is attached to a multi-layer resin mask organic substrate. A plurality of bonding wires are attached between conductive parts of the semiconductor chip and the multi-layer resin mask organic substrate to create selective electrical connections. A transparent window is placed on top of the semiconductor chip and covers the vision chip active area. A wire shielding block is formed on the multi-layer resin mask organic substrate around the semiconductor chip covering and protecting the bonding wires and the semiconductor chip not covered by the transparent window. A liquid encapsulant is formed to protectively seal the device but does not block the vision of the vision chip active area through the transparent window.

Abstract: The present invention provides a ball grid array semiconductor package having a resin coated metal core substrate. The semiconductor device comprises a resin coated metal core substrate, solder balls, chip adhesive material, at least one semiconductor chip, bonding wires, and encapsulant. The metal core is made from a conductive material, for example, a metal lead frame and coated with a resin to form a resin covered metal core substrate structure. The resin coating covers both sides of the metal core except for selected areas of the metal core, such as where it is desired to attach the bonding wires or the solder balls. A liquid encapsulant is formed to cover desired areas of the resin coated substrate, bonding wires, adhesive material, and the semiconductor chip. Since the outer surface of the substrate is substantially of resin material, the adhesion between the substrate and the encapsulant is much stronger than if a standard conventional substrate was used.