Abstract: A power splitter that has a small package size and repeatable electrical characteristics. The power splitter includes a low temperature co-fired ceramic (LTTC) substrate with several layers. Electrical components such as resistors, capacitors and ground planes are integrated within the LTTC substrate. A binocular core transformer is attached to the upper surface of the LTTC substrate and is electrically connected to the resistors, capacitors and ground plane. The transformer provides impedance matching and dividing functions. The LTTC substrate has electrically conductive vias extending through the layers. The vias are used to connect the power splitter to terminals on outer surfaces of the substrate and to make electrical connections between the layers of the LTTC substrate. The power splitter circuit requires only one transformer.

Abstract: A double balanced mixer for mixing an RF input signal with a local oscillator signal to provide at an output an intermediate frequency signal with a high third order intercept point. A first and second local oscillator balun receives a local oscillator signal. A first and second RF balun receives a RF signal. A first mixer is coupled to the first local oscillator balun and the first RF balun. A second mixer is coupled in parallel with the first mixer. The second mixer is coupled to the second local oscillator balun and the second RF balun. The parallel coupled mixers provide an intermediate frequency signal. A first intermediate frequency balun is coupled to the first mixer and a second intermediate frequency balun is coupled to the second mixer. The mixer also has increased isolation.

Abstract: A modular miniature circuit built entirely within the case of the module without a primary printed circuit board conventionally used as a bottom support for the circuit component. The circuit components are mounted on the inside of the case and the leads of the components are attached directly to the module's terminals, greatly reducing lead inductance. The elimination of the primary PC board results in a substantial reduction in cost and physical size and the reduction in lead lengths results in a significant enhancement of high frequency performance. The "flip chip" construction provides a flat surface for pick up by automatic assembly equipment without the added cost of a cover.