Abstract: A sub harmonic mixer has improved electrical performance in a small package size. The mixer has a low temperature co-fired ceramic substrate. Coupled lines are located within the substrate and connected to an LO port, an RF port and an intermediate frequency port. Three capacitors are formed within the substrate. Vias extend through the substrate. A diode package is mounted on the substrate.

Abstract: A power splitter has a small size with good electrical performance. The power splitter includes a substrate with several dielectric layers. A capacitor is formed between two of the dielectric layers. A pair of inductors are formed by circuit lines located on the dielectric layers. Several terminals are located on outer surfaces of the substrate. Conductive vias extend between the layers in order to provide an electrical connection between the capacitor, the inductors and the terminals. The substrate is formed from layers of low temperature co-fired ceramic. The circuit lines have a curving or sinuous shape on the dielectric layers. The inductors are electromagnetically coupled. The power splitter has a compact overall size.

Abstract: A triple balanced mixer has a compact size and is readily assembled. The triple balanced mixer has a planar substrate that is formed from several layers of low temperature co-fired ceramic. The substrate has a top layer, a bottom layer and inner layers. Vias extend through the substrate. A local oscillator balun and RF balun are located on the inner layers. An intermediate frequency balun is mounted to the top layer. Diode rings are mounted on the top layer. The diode rings are electrically connected to the local oscillator balun, the RF balun and the intermediate frequency balun through the vias.

Abstract: A power splitter that has a small package size and low cross-talk noise. The power splitter includes a low temperature co-fired ceramic (LTTC) substrate with several layers. Electrical components such as transmission lines and resistors are integrated onto and within the LTCC substrate. The power splitter provides impedance matching and dividing functions. The LTCC substrate has counter rotating spiral shaped circuit lines and electrically conductive vias extending therethrough. The vias are used to connect the power splitter to an external printed circuit board. The vias are also used to make electrical connections between the layers of the LTCC substrate. The counter rotating circuit lines allow the power splitter to have a small package size and low cross-talk noise.

Abstract: A package for containing an electronic circuit assembly. The package includes a housing having a bottom surface and walls extending upwardly from the bottom surface. The walls and the bottom surface define a cavity in the housing. The cavity holds the electronic circuit assembly. A post extends outwardly from the walls. The post is integrally formed with the housing. The post is connected to the wall on one end and a threaded annular sleeve portion is located at the other end. The threaded annular sleeve portion is adapted to receive a female connector portion. A bore passes through the post and the wall. The bore holds a feed through terminal. A cover is located over the cavity and is attached to the housing.

Abstract: A directional coupler that has a small package size and repeatable electrical characteristics. The directional coupler includes a low temperature co-fired ceramic (LTCC) substrate with several layers. Electrical components such as resistors and capacitors are integrated within the LTCC substrate. A transformer is attached to the upper surface of the LTCC substrate and is electrically connected to the resistors and capacitors. The LTCC substrate has electrically conductive vias extending therethrough. The vias are used to make electrical connections between the layers of the LTCC substrate.

Abstract: A band pass hairpin filter that has improved pass band performance and low loss. The filter has a dielectric substrate. The dielectric substrate has a top and bottom surface. A hairpin resonator is mounted to the top surface. The resonator has an open end and a closed end. An input coupling element is located adjacent to and is communicated with the resonator. An output coupling element is located adjacent to and is communicated with the resonator. A first inductive element is connected to the resonator. A second inductive element is connected to the input coupling element. A third inductive element is connected to the output coupling element.

Abstract: A relay switching device for switching high frequency signals has high reliability and stable insertion loss. The switching device has a housing with a base and a case. The case has a bore and the base has a slot. An electromagnet is mounted in the case. A reed holder has a pair of ends. One end of the reed holder is mounted in the bore adjacent the electromagnet. A pair of terminals are mounted in the base and extend into the slot. A guide member is mounted in the slot. A conductive reed is mounted to the other end of the reed holder. The reed is supported by the guide member and extends over the terminals. The electromagnet moves the reed between an open and closed position. The guide member prevents rotation of the reed as it moves between the open and closed positions.

Abstract: A fine tuning system for adjusting the frequency of voltage controlled oscillators with fine resolution by mechanical tuning. A resonator is located on the dielectric substrate resonant frequency. The tuning system has metal strip located on a dielectric substrate. The metal strip has a pair of edges and a primary cut extending into the metal strip. The primary cut has a pair of ends. Several cavities in the metal strip are located adjacent an end of the primary cut. An elongated slot is cut into the metal strip. The slot is located between the cavities and an edge. The slot reduces the coupling of the tuning elements such as shorts, formed by cavities, to the resonator, and therefore allows fine tuning of the resonant frequency. Location of the slot closer to the cavities results in more fine tuning. Location of the slot further away from the cavities results in coarse tuning. An alternative embodiment is shown.

Abstract: A wide band directional coupler of the type using ferrite cores and discrete winding in which a special winding method and its position on the core improves coupling flatness, directivity, as well as input and output VSWR.