Abstract: An apparatus and method for co-axial wire bonding to improve impedance and electrical package connection performance of a substrate attached to the interior of an electrical device package. One or more wire bonds making ground connections between a package and an internal electrical circuit substrate make a non-contact geometrical crossing over an active electrical signal wire.

Abstract: An apparatus and method for shielding for surface-mount LTCC components and filters to increase the signal isolation from input signal port to output signal port, and to increase isolation from other electrical signals external to the component or filter. Some embodiments include an interposer two-sided and plated through printed circuit board to provide a constant impedance transition from a surface-mount device input and output ports to corresponding input and output connection points of a circuit on a printed circuit board onto which the device is mounted, including a ground plane transition.

Abstract: An apparatus and method for a shielding structure for surface-mount LTCC components and filters to increase the signal isolation from input signal port to output signal port. An LTCC filter device with an increased rejection of undesired frequencies in a stopband and minimal distortion or loss of desired signals in a passband.

Abstract: LTCC structure extends between top and bottom surfaces, with at least one cavity being formed within the structure and extending from the top surface inwardly in the direction of the bottom surface. A die is disposed within the cavity a top surface of the die is positioned flush with the top surface of the package, resulted in the shortest length of the wire box connecting the die with the LTCC structure and ultimately reducing the inductance.

Abstract: An apparatus for a shielding structure for surface-mount components and filters to increase the signal isolation from input signal port to output signal port. An LTCC filter device with an increased rejection of undesired frequencies in a stopband and minimal distortion or loss of desired signals in a passband.

Abstract: An apparatus and method for electrical power splitting with a reduced physical size by using reactive electrical components, producing an increase in signal isolation among output ports and a reduction in internal electrical losses, and operable over a large bandwidth extending from DC to microwave frequencies. Attenuators with capacitors in parallel are used inboard of each output port to achieve extended broadband operation. 2-way and N-way power splitters and corresponding power combiners are described.

Abstract: LTCC structure extends between top and bottom surfaces, with at least one cavity being formed within the structure and extending from the top surface inwardly in the direction of the bottom surface. A die is disposed within the cavity a top surface of the die is positioned flush with the top surface of the package, resulted in the shortest length of the wire box connecting the die with the LTCC structure and ultimately reducing the inductance.

Abstract: A latching electromechanical RF switch is formed with an RF switch cavity having at least one inlet port and at least one outlet ports having switch contacts. A leaf contact member moveable between a first contact position connecting the switch contacts and a second position spaced from the switch contacts. A solenoid mounted in the cavity. A housing is formed with a hollow passage. An intermediate permanent magnet provided within the housing. A connecting member assembly is moveable within the hollow passage. The contact leaf member is connected to one end with a permanent magnet provided at another end of the connecting member. The intermediate magnet attracts and retains the permanent magnet and the contact leaf member in the first contact position. Upon reaching the first contact position electric current supply to the solenoid is terminated.

Abstract: A balun device comprises an input microstrip, a first output microstrip, a second output microstrip, and a junction comprising a conductive termination of the input microstrip, the first output microstrip, and the second output microstrip, whereby an input signal provided to the input microstrip will propagate through the first output microstrip as a first output signal and through the second output microstrip as a second output signal, wherein the phase of the first output signal is identical to the phase of the input signal, and wherein the junction inverts the phase of the second output signal relative to the phase of the input signal and the first output signal.

Abstract: A planar balun comprises a balun input, a first balun output, a second balun output, two primary coupled lines with a first cross-sectional area disposed on an inhomogeneous medium, and two secondary coupled lines with a second cross-sectional area, the second coupled lines disposed on an inhomogeneous medium. Each of the primary coupled lines are coupled to one of the secondary coupled lines with a predetermined uniform surface space therebetween. The first cross-sectional area and the second cross-sectional area are unequal, thereby producing pairs of asymmetric coupled lines.

Abstract: A planar balun comprises a balun input, a first balun output, a second balun output, two primary coupled lines with a first cross-sectional area disposed on an inhomogeneous medium, and two secondary coupled lines with a second cross-sectional area, the second coupled lines disposed on an inhomogeneous medium. Each of the primary coupled lines are coupled to one of the secondary coupled lines with a predetermined uniform surface space therebetween. The first cross-sectional area and the second cross-sectional area are unequal, thereby producing pairs of asymmetric coupled lines.

Abstract: An LTCC carrier composed of thermosetting polymer, woven glass fiber and ceramic has gold over nickel contact pads on top and bottom surfaces and conductive vias therethrough between aligned pairs of top and bottom pads. The vias prevent undesirable inductive paths from limiting high frequency operation of the circuitry. Solder deposits on the top pads attach the LTCC component, which is further secured to the carrier by epoxy, thus improving resistance to thermal stress and mechanical shock. A slot through the carrier body between top and bottom surfaces further reduces thermal stress and mechanical shock. Metallized castellations on opposite carrier sides provide additional surface area for reflow solder joints with the PCB, and a means for visually inspecting the solder joint quality. A gap in the metallization on the top layer of the carrier prevents solder spreading during multiple soldering cycles, which may result in poor solder joints.

Abstract: A miniature wideband balun is realized wherein a miniature rectangular high permeability ferrite binocular core is wound with a single wire on the first of three legs and a twisted pair of wires on the third of three legs. Each winding is configured from 36 gauge wire to include two turns with precise positioning and spacing on the legs, and precise control over the length and position of the non-wound wire portions. The non-wound wire portions have their ends welded to the conductive terminals of a flat insulating substrate which the core is bonded to. Such an approach results in a wideband response of from 10 MHz to at least 6000 MHz with a substantially flat insertion loss and a low return loss. Additionally, a lid is bonded to the top of the core in order to form a package conducive to handling by standard pick and place robotic assembly machinery.

Abstract: The wrench adaptor of this invention provides an easy and convenient tool for connection and disconnection of the SMA connections in constrained spaces while allowing use of a standard torque wrench or just fingers. The channel design of the wrench adaptor, accommodating the cable and the protective sleeve therefor, allows access to SMA connectors without bending or disturbing semi-rigid or rigid cables. The wrench adaptor is shown in two embodiments—a single-ended and a double-ended form. The adaptor facilitates access to the hexagonal nut at the panel of an RF device which is mounted to a threaded stud and offsets the wrench application to a location away from the panel. As many of the RF cables have crimped or soldered portions adjacent or within the connector, provision is made in the adaptor by way of a hollow semicylindrical form to cradle the semi-rigid or rigid cable.

Abstract: A tunable microstrip having removable contactless tuning stubs is used in the fabrication of a tunable T-junction circuit. Arrays of tuning stubs are formed in proximity to both sides of a microstrip signal trace. Each array of tuning stubs has a shared grounding bus connected by multiple vias to the ground plane. The sinusoidally patterned shape of the tuning stubs and their proximity to the signal trace provides a minimum breakdown voltage of 1.3 kV and a tuning sensitivity of approximately 0.01 dB to 0.02 dB.

Abstract: A circuit packaging system allows a combination of integrated circuit dice and surface mount electronic components to be mounted on a printed circuit board which is in turn mounted on a lead frame and encapsulated, thus providing an environmentally sealed package which is manufactured using standard circuit fabrication methods and machinery.

Abstract: An ultra-low phase noise voltage controlled oscillator uses a single bipolar transistor Colpitts oscillator circuit and a noise-reducing negative feedback path consisting of a capacitor and a second element which may be a second capacitor, an inductor or a resistor. The negative feedback path is kept separate from any DC biasing paths in the circuit. A pair of varactor diodes are used to provide resonant frequency control.

Abstract: A low-noise amplifier with high linearity has two common source FET amplifying stages, where the amplifier performance is linearized by use of a second stage active biasing circuit including a current mirror with a feedback network. The linearity improvement technique is employed on a 0.5-2 GHz flat gain amplifier. The improvement causes nodegradation to other RF parameters and allows for the amplifier circuit to be realized in a gallium arsenide microwave monolithic integrated circuit.

Abstract: An LTCC carrier composed of thermosetting polymer, woven glass fiber and ceramic has gold over nickel contact pads on top and bottom surfaces and conductive vias therethrough between aligned pairs of top and bottom pads. The vias prevent undesirable inductive paths from limiting high frequency operation of the circuitry. Solder deposits on the top pads attach the LTCC component, which is further secured to the carrier by epoxy, thus improving resistance to thermal stress and mechanical shock. A slot through the carrier body between top and bottom surfaces further reduces thermal stress and mechanical shock. Metallized castellations on opposite carrier sides provide additional surface area for reflow solder joints with the PCB, and a means for visually inspecting the solder joint quality. A gap in the metallization on the top layer of the carrier prevents solder spreading during multiple soldering cycles, which may result in poor solder joints.

Abstract: A miniaturized wideband surface mount bias tee comprises a printed circuit board with a functioning first capacitor and a dummy second capacitor, and an inductor bonded atop the two capacitors. The capacitors, adhesive and solder are depositable by standard surface mount pick and place machinery. The inductor wires are bonded to one of the first capacitor bonding pads and to an inductor bonding pad. The circuit element bonding pads include portions bordering the pc board edges and are conductively connected to bonding pads on the bottom face of the pc board. Conductive thru-vias for the first capacitor bonding pads reduce parasitic inductance and extend the operating frequency range. A flat-topped insulating cap encloses the bias tee sides and top. The cap forms an air gap between the inductor and circuit elements and provides a surface for manipulating the bias tee with present-day assembly equipment.