Abstract: A method of producing wafers or discs from an industrially grown crystal includes: scanning a crystal in volume and forming a 3D volumetric digital model of the crystal, recording 3D spatial coordinates of defects detected during said scanning, measuring one or more crystal axes provided by a crystalline structure of the crystal, and recording this crystal axis in said 3D model of the crystal, coring out one or more cores from the crystal in a selected crystal direction which is parallel to one of said crystal axes or at a defined angle with respect to said crystal axis, and slicing the core orthogonally to the selected crystal direction with a wafer slicing machine comprising a slicing tool comprising a plurality of cutting wires or blades spaced at a regular slicing pitch configured to cut wafers of identical thicknesses from the core.

Abstract: Optical quality control system for controlling the quality of a high refractive index solid (2), comprising a container (4) configured to receive the solid therein, a structured light source (30), an optical inspection zone configured for receiving an optical device (10) or an eye of a human observer, and a high refractive index liquid (12) for insertion in the container in a volume sufficient to fully immerse the translucent solid. The structured light source is configured to project a planar light fan (20) through the high refractive index solid immersed in the high refractive index liquid generating a illuminated cross-section (18) in the solid. The optical inspection zone is arranged at a top end of the container adapted for inspection of the illuminated cross-section in a direction transverse to a plane (P) defined by the planar illuminated cross-section.