Patents Assigned to SDK-Technik GmbH
  • Patent number: 6736204
    Abstract: This invention relates to a heat transfer surface (3) or tubular or plate-like bodies (4) having a microstructure (7) projecting out of the base surface (3a) and consisting of projections (6) which are galvanized onto the base surface (3) with a minimum height of 10 &mgr;m. The object of this invention is to create a heat transfer surface (3) of this type which is characterized by an increase in thermal efficiency of its heat transfer surfaces (3) with the smallest possible temperature differences and is suitable for both nucleate boiling and film condensation with a justifiable manufacturing expense. The object is achieved according to this invention by the fact that the base surface (3a) is covered entirely or partially with projections (6); these projections (6) are applied in the form of ordered microstructures (7) and they have a pin shape, extending with their longitudinal axis (6c) either at a right angle to the base surface (3a) or at an angle (&agr;) between 30° and 90°.
    Type: Grant
    Filed: November 27, 2002
    Date of Patent: May 18, 2004
    Assignee: SDK-Technik GmbH
    Inventors: Dieter Gollan, Jovan Mitrovic, Andreas Schulz, Helmut Pietsch