Patents Assigned to Sebacs Co., Ltd.
  • Patent number: 8079758
    Abstract: A sensor part is provided with a printed circuit board that is made of resin and formed with a pair of electrically conductive metal patterns. Each of the pair of electrically conductive metal patterns includes: a first pattern part connected to a pair of electrodes of a temperature sensor; a second pattern part connected to a pair of conductive wires; and a connection part making a connection between the first and second pattern parts. The connection between the pair of electrodes of the temperature sensor and the first pattern part or between the pair of conductive wires and the second pattern part is made with the use of Dotite or solder.
    Type: Grant
    Filed: October 24, 2008
    Date of Patent: December 20, 2011
    Assignee: Sebacs Co., Ltd.
    Inventors: Kenji Kamei, Seiji Tsutsui