Patents Assigned to Seelink Technology
  • Thermal testing apparatus and method
    Patent number: 5713666
    Abstract: A method and apparatus for measuring thermal properties of electronic components (25) encapsulated in packaging is described. The method can be used to measure a junction temperature T.sub.j of the electronic component (25), without removing the package (30), and during operation of the electronic component (25) by a power supply.
    Type: Grant
    Filed: August 30, 1995
    Date of Patent: February 3, 1998
    Assignee: Seelink Technology
    Inventors: Kusuma S. Seelin, Srikanth N. Seelin