Abstract: A soldering apparatus for selective soldering, comprising a solder bath for holding the molten solder at least one solder nozzle a solder pump for conveying solder from the solder bath through the solder nozzle a movement device for the relative movement of the solder nozzle and an assembly to be soldered wherein several solder nozzles are provided in several solder nozzle assemblies, with each solder nozzle assembly having one or more solder nozzles and wherein each solder nozzle assembly may be assigned an assembly, and the movement device is designed for synchronous movement of the several solder nozzle assemblies relative to the respective assemblies in the horizontal X-Y plane, and the soldering machine is so designed that the individual solder nozzle assemblies and the respective assemblies may be moved towards one another and independently of one another in the vertical direction (Z-direction) by means of a coupling device.

Abstract: The invention relates to a device for the controlled displacement of an upward-directed spray nozzle to individual spray points that are situated a distance apart, in particular for spraying flux in wave soldering units. The spray nozzle is situated axially on a rotary axle rotated by a rotary drive, to which a deflection force directly radially to the rotary axle is applied in such a way that, when the rotary axle rotates, the spray nozzle executes a self-contained annular motion whose contour is limited in the radial direction by a stationary mask surrounding the spray nozzle.

Abstract: A process chamber of an installation for the thermal treatment of printed circuit boards is described. The process chamber may include a fan wheel supported on a shaft parallel to the printed circuit boards, the fan wheel being disposed between two walls of the process chamber. The fan wheel is open at its two end faces and the two end faces are at such a distance from the walls of the process chamber that gas flows in unimpeded in two substreams between the end faces of the fan wheel and the walls and flows out from the cylindrical surface of the fan wheel over the length thereof and in the extent of the process chamber in the form of a ribbon-shaped gas stream, the gas stream being directed essentially in the cross section through a channel onto the printed circuit boards.

Abstract: The invention relates to a process for the reflow soldering of printed circuit board assemblies provided with solder paste in a sealed chamber with heating in the chamber. In a first process step, the pressure in the chamber is amplified in comparison with the atmospheric pressure and the temperature in the chamber is increased by convection heating to melt the solder paste and, in a second process step, the pressure is again lowered to atmospheric pressure in controlled manner while maintaining the temperature.

Abstract: The invention relates to a supporting device of the transport device of a soldering apparatus for the conveying of printed-circuit boards with at least two revolving, endless transport chains, said transport chains running in guide rails in the transport zone and each passing through two guide elements at the ends of the transport zone, wherein, for adaptation to the width of the respective printed-circuit boards, the guide elements are mounted on a carrier such as to be displaccable transverse to the conveying direction. The guide elements, each associated with a respective conveying chain, are interconnected by flexible tension elements, said tension elements being adjustable with regard to their tensile stress and running parallel to the respective conveying chain in the transport zone, the value of the tensile stress being so highly adjusted that the tension elements prevent the guide rails from deviating from a straight line.

Abstract: The invention relates to a supporting device of the transport device of a soldering apparatus for the conveying of printed-circuit boards with at least two revolving, endless transport chains, said transport chains running in guide rails in the transport zone and each passing through two guide elements at the ends of the transport zone, wherein, for adaptation to the width of the respective printed-circuit boards, the guide elements are mounted on a carrier such as to be displaceable transverse to the conveying direction. The guide elements, each associated with a respective conveying chain, are interconnected by flexible tension elements, said tension elements being adjustable with regard to their tensile stress and running parallel to the respective conveying chain in the transport zone, the value of the tensile stress is being so highly adjusted that the tension elements prevent the guide rails from deviating from a straight line.

Abstract: The invention relates to a process chamber of an installation for the thermal treatment of printed circuit boards, with a fan wheel supported on a shaft parallel to the printed circuit boards, said fan wheel being disposed between two walls of the process chamber. The fan wheel is open at its two end faces and the two end faces are at such a distance from the walls of the process chamber that gas flows in unimpeded in two substreams between the end faces of the fan wheel and the walls and flows out from the cylindrical surface of the fan wheel over the length thereof and in the extent of the process chamber in the form of a ribbon-shaped gas stream, said gas stream being directed essentially in said cross section through a channel onto the printed circuit boards.

Abstract: The invention relates to a process for soldering electrical components to soldering positions, which are provided with soldering material, on a plastic sheet provided with applied conductor tracks. The plastic sheet is heated, from the side which is remote from the components, to a below its damage temperature and after heating its side which is remote from the components is thermally insulated. Then, the side which faces the components is acted on by a heating-gas stream which is concentrated onto the locations which are to be soldered by a template which has windows.

Abstract: The invention relates to a process for soldering electrical components to soldering positions, which are provided with soldering material, on a plastic sheet provided with applied conductor tracks. The plastic sheet is heated, from the side which is remote from the components, to a below its damage temperature and after heating its side which is remote from the components is thermally insulated. Then, the side which faces the components is acted on by a heating-gas stream which is concentrated onto the locations which are to be soldered by a template which has windows.

Abstract: An apparatus for the temperature regulation processing of electronic components such as semiconductor circuits, printed circuit boards and the like comprises a temperature regulated housing through which the components are conveyed on carriers. The carriers enter through an inlet slot in the housing provided with temperature regulating members and are conveyed onto a magazine and then out through an outlet slot opposite the inlet slot once processing is complete. Inside the housing, the carriers are loaded on a progressively loaded magazine provided with adjacently arranged holders. Once all the holders are loaded, the magazine is filled and in an end position. The magazine is then displaced to its starting position in a fast reverse run. A new carrier is conveyed in through the inlet slot thereby causing the temperature regulated carrier occupying the holder to be conveyed out through the outlet slot.

Abstract: A method and apparatus for the temperature regulation of components such as semiconductor circuits, printed circuit boards and the like. The components are conveyed on carriers through an inlet slot into a temperature regulating housing provided with temperature regulating members and are convey out through an outlet slot opposite the inlet slot. In the housing, the carriers are loaded on a magazine provided with adjacently arranged holders. After the first holder is loaded in the starting position, the magazine is displaced progressively in one direction into successive positions in which the remaining holders of the magazine are loaded one after the other. Once all the holders are loaded, the magazine is filled and in an end position. Thereupon the magazine is displaced back to its starting position in a fast reverse run in the opposite direction.