Patents Assigned to Seiconductor Manufacturing International (Shanghai) Corporation
  • Publication number: 20100283926
    Abstract: In a specific embodiment, the present invention provides an LCOS device. The device has a semiconductor substrate, e.g., silicon substrate. The device has a transistor formed within the semiconductor substrate. The transistor has a first node, a second node, and a row node. A first capacitor structure is coupled to the transistor. The first capacitor structure includes a first polysilicon layer coupled to the second node of the transistor. The first capacitor structure also has a first capacitor insulating layer overlying the first polysilicon layer and a second polysilicon layer overlying the insulating layer. The second polysilicon layer is coupled to a reference potential, e.g., ground. The device has a second capacitor structure coupled to the transistor. The second capacitor structure has a first metal layer coupled to the reference potential, a second capacitor insulating layer, and a second metal layer coupled to the second node of the transistor. A pixel electrode comprises the first metal layer.
    Type: Application
    Filed: October 27, 2008
    Publication date: November 11, 2010
    Applicant: Seiconductor Manufacturing International (Shanghai) Corporation
    Inventors: Herb Huang, Wei Min Li, Haiting Li, Ziru Ren, Yinan Han