Abstract: The present invention relates to a method of and an apparatus for packaging a semiconductor device and the like to package the semiconductor device and the like completely associated with resin.A process for packaging a semiconductor device and the like according to the present invention comprises the steps of providing a tablet of thermoplastic resin such as epoxy resin, weighing the tablet for upper and lower packages, preheating the upper and lower packages, then compression molding the packages in a package shape, coating the opposed surfaces to be bonded of the upper and lower packages with a fusible bonding agent such as thermoplastic resin and/or bonding agent, then interposing a chip of a semiconductor device and the like between the upper package and the lower package, heating the upper and lower packages while supplying nitrogen gas in a vacuum molding machine, bonding the upper and lower packages, and conducting an antioxidation of a metal portion.

Abstract: The invention proposes a device designed for separating IC lead frames, boards, etc., piece by piece, and loading them continuously, and composed of a work stocker which holds laminated work of strips; a work-pressing mechanism which continuously presses the work within the work stocker; a separating mechanism which strips away the laminated work piece by piece from the lowest part thereof; and a pusher mechanism which pushes outside the stripped work from the work stocker; and wherein the separating mechanism is installed with a detector which finds out double sheets of the strips and stops operation of the pusher; and the separator is installed at its work exit end with a positioning pin of go-in-and-out of a taper shape which positions end points of the work pushed out by the pusher.