Patents Assigned to Seik Epson Corporation
  • Publication number: 20070133355
    Abstract: [Object] To provide a timepiece spring whereby it is possible to ensure high precision and stable operation of precision mechanisms such as timepieces, and to provide a timepiece spring, a mainspring, a hairspring, and a timepiece wherein long-term operation can be ensured when the spring is used as a power source. [Means] A mainspring used as a source to power a drive source is formed from a special titanium alloy and has an S-shape when freely spread out, wherein the inflection point at which the curving direction of the freely spread-out shape changes is formed farther inward than the midpoint of an inner end at the end of the winding side and an outer end at the end opposite the inner end. The titanium alloy constituting the present invention has high tensile stress and a low average Young's modulus, making it possible to increase the mechanical energy accumulated in the mainspring 31.
    Type: Application
    Filed: November 1, 2004
    Publication date: June 14, 2007
    Applicant: Seik Epson Corporation
    Inventors: Tatsuo Hara, Kazuma Miyata
  • Patent number: 6639340
    Abstract: Provided is a method for manufacturing a piezoelectric element that has excellent piezoelectric characteristics and can be made into a thicker film. A piezoelectric thin film is crystallized by a process in which piezoelectric precursor films 4021 through 4025 containing the metal elements of a piezoelectric ceramic are coated with a material, dried, pyrolyzed, and then heat-treated under prescribed conditions in a diffusion furnace. With this method, a piezoelectric thin film can be made into a thicker film without initiating cracking.
    Type: Grant
    Filed: April 13, 2000
    Date of Patent: October 28, 2003
    Assignee: Seik Epson Corporation
    Inventors: Hong Qiu, Koji Sumi, Souichi Moriya, Masato Shimada, Tsutomu Nishiwaki