Abstract: The present invention relates to a process of the invention for separating at least one first material from a mixture comprising this at least one first material and at least one second material, which comprises the steps: (A) Contacting of at least one magnetic particle and at least one bifunctional molecule or an adduct of the two with the mixture comprising the at least one first material and at least one second material so that an adduct is formed from the at least one magnetic particle, the bifunctional compound of the general formula (I) and the at least one first material, (B) suspension of the adduct obtained in step (A) in a suitable suspension medium, (C) separation of the adduct present in the suspension from step (B) from the suspension by application of a magnetic field, (D) if appropriate, dissociation of the adduct separated off in step (C) in order to obtain the at least one first material. a corresponding adduct and the use of such an adduct for the separation of mixtures of materials.

Abstract: A method of forming a metal interconnect structure and via plugs over a dielectric layer having a plurality of vias formed therein is disclosed. The method comprises the steps of: forming tungsten via plugs in the plurality of vias; depositing a metal layer over the dielectric layer and the plurality of tungsten via plugs; patterning and etching the metal layer using a photoresist layer to form the metal interconnect structure; oxidizing the metal interconnect structure and the tungsten via plugs to form a metal oxide layer over the metal interconnect structure and tungsten via plugs; and performing a wet strip on the metal interconnect structure.