Patents Assigned to Sekisui Chemicals Co., Ltd.
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Publication number: 20140000977Abstract: The present invention provides an interlayer film for laminated glass, that exhibits an excellent sound-insulating performance for solid-borne sound in an environment at or below 0° C. Another object is to provide laminated glass that is obtained using this interlayer film for laminated glass. The present invention is an interlayer film for laminated glass, that has a sound-insulating layer for which a temperature T1, which is the temperature that gives the maximum value of tan ? at a frequency of 1 Hz, is in the range from ?30° C. to 0° C.Type: ApplicationFiled: September 6, 2013Publication date: January 2, 2014Applicant: Sekisui Chemical Co., Ltd.Inventors: Shouta MATSUDA, Kozo NAKAMURA, Michio SHIMAMOTO, Sinyul YANG
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Patent number: 8617445Abstract: The present invention provides a process for producing an oriented thermoplastic polyester resin sheet which is excellent in tensile strength, tencile modulas and heat resistance, and a light laminate-molded body using the same, which has a low linear expansion coefficient and is excellent in impact resistance, durability, easiness of handling, productivity, and others. A process for producing an oriented thermoplastic polyester resin sheet, which includes: pultrusion-drawing a thermoplastic polyester resin sheet in an amorphous state at a temperature from the glass transition temperature of the thermoplastic polyester resin ?20° C. to the glass transition temperature of the thermoplastic polyester resin +20° C.; and then drawing the resultant uniaxially at a temperature higher than the temperature for the pultrusion-drawing. A laminate-molded body, wherein a thermoplastic resin layer is laminated on each of the surfaces of the resultant oriented thermoplastic polyester resin sheet.Type: GrantFiled: February 17, 2006Date of Patent: December 31, 2013Assignee: Sekisui Chemical Co., Ltd.Inventors: Shigeru Ogasawara, Hirotsugu Yoshida, Hisashi Eguchi, Ryuichi Matsuo
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Publication number: 20130337229Abstract: A roughened cured material allows reduction of surface roughness and increase in adhesive strength between a cured object and a metal layer. A roughened cured material is obtained by advancing curing of an epoxy resin material to obtain a preliminary-cured material and conducting roughening treatment on a surface of the preliminary-cured material. The epoxy resin material contains an epoxy resin, a curing agent, and a silica whose mean particle diameter is not smaller than 0.2 ?m but not larger than 1.2 ?m. When a roughening-treated surface of the roughened cured material is photographed with a scanning electron microscope, in a 5 ?m×5 ?m sized area of the roughening-treated surface in a photographed image, the number of particles of the silica that are exposed from the roughening-treated surface and whose exposed portions have a maximum length of 0.3 ?M or longer in the image is not greater than 15.Type: ApplicationFiled: January 27, 2012Publication date: December 19, 2013Applicant: SEKISUI CHEMICAL CO., LTD.Inventors: Takayuki Kobayashi, Koichi Shibayama, Shuichiro Matsumoto
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Patent number: 8611714Abstract: [Object] The present invention has the object of providing an optical fiber enabling high-speed communication, that exhibits superior transparency and excellent flexibility, and that includes trichloroethyl methacrylate as a main component of the core portion monomer. [Means for Solving Problem] An optical fiber configured from a core portion and a cladding portion disposed on an outer periphery of the core portion, wherein the core portion is formed by a main constituent component of a polymer of monomers that include at least 70 wt % of trichloroethyl methacrylate (TCEMA), the cladding portion is formed by a main constituent component of a polymer of monomers which include at least 20 wt % of methyl methacrylate (MMA).Type: GrantFiled: July 5, 2010Date of Patent: December 17, 2013Assignees: Sekisui Chemical Co., Ltd., Keio UniversityInventors: Hirotsugu Yoshida, Ryosuke Nakao, Hiroka Inabe, Tazuru Okamoto, Yuki Masabe, Masato Aoyama, Yasuhiro Koike
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Patent number: 8609246Abstract: A conductive fine particle, which is used for conductive connection between fine electrodes and tends not to give rise to a crack in the solder layer or disconnection caused by breakage in the connection interface between an electrode and the conductive fine particle even with a drop impact and the like, and tends not to have fatigue even after repetitive heating and cooling; an anisotropic conductive material obtained by using the conductive fine particle; and a conductive connection structure.Type: GrantFiled: March 31, 2008Date of Patent: December 17, 2013Assignee: Sekisui Chemical Co., Ltd.Inventors: Ren-de Sun, Kiyoto Matsushita, Taku Sasaki, Shinya Uenoyama, Masaki Okuda, Nobuyuki Okinaga
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Publication number: 20130323515Abstract: The present invention provides an interlayer film for laminated glass which enables production of laminated glass with high heat-shielding properties and a low |YI| value; and laminated glass including the interlayer film for laminated glass. An interlayer film for laminated glass according to the present invention includes a thermoplastic resin; tungsten oxide particles; and at least one component selected from a phthalocyanine compound, a naphthalocyanine compound, and an anthracocyanine compound; and a laminated glass of the present invention comprises: a first member for laminated glass; a second member for laminated glass; and a single-layer interlayer film or a multi-layer interlayer film between the first member for laminated glass and the second member for laminated glass, wherein the single-layer interlayer film or the multi-layer interlayer film includes the interlayer film for laminated glass according to the present invention.Type: ApplicationFiled: February 10, 2012Publication date: December 5, 2013Applicant: SEKISUI CHEMICAL CO., LTD.Inventors: Takazumi Okabayashi, Juichi Fukatani, Daizou Ii, Hirofumi Kitano, Ryuta Tsunoda, Keiichi Osano
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Patent number: 8600210Abstract: A GI type optical fiber of the present invention is a GI type optical fiber having a core component and a cladding component disposed around the outer periphery of the core component, the core component includes a polymer containing at least 55 wt % chlorostyrene monomer and a dopant, and the cladding component includes a polymer of a monomer containing at least 35 wt % methyl methacrylate. It is an object of the present invention to provide a GI type optical fiber in which chlorostyrene is used as the predominant component of the monomer that constitutes the core component, and therefore has excellent transparency and good flexibility, and allows high-speed communication.Type: GrantFiled: February 4, 2010Date of Patent: December 3, 2013Assignees: Sekisui Chemical Co., Ltd., Keio UniversityInventors: Hirotsugu Yoshida, Tazuru Okamoto, Ryosuke Nakao, Hiroka Inabe, Yuki Masabe, Yasuhiro Koike
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Patent number: 8586323Abstract: The present invention provides a blood coagulation promoter capable of exerting both excellent blood coagulation promoting ability and excellent blood clot detaching ability; and a blood collection tube accommodating the blood coagulation promoter. The present invention provides a blood coagulation promoter which includes a hardly water soluble polyoxyalkylene derivative; a partially saponificated polyvinyl alcohol; at least one substance selected from the group consisting of adsorptive inorganic substances and hydrolases capable of hydrolyzing a bond between Arg and an arbitrary amino acid reside and/or a bond between Lys and an arbitrary amino acid residue in a peptide chain; a polyvinylpyrrolidone; and preferably a water-soluble silicone oil, and a blood collection tube in which the blood coagulation promoter is accommodated in a tubular vessel having a bottom.Type: GrantFiled: April 21, 2004Date of Patent: November 19, 2013Assignee: Sekisui Chemical Co., Ltd.Inventors: Ryusuke Okamoto, Katsuya Togawa, Hironobu Isogawa
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Publication number: 20130280618Abstract: The present invention includes an electrolyte in which an organic acid lithium salt (A) and a boron compound (B) are mixed.Type: ApplicationFiled: September 26, 2011Publication date: October 24, 2013Applicant: SEKISUI CHEMICAL CO., LTD.Inventors: Kenichi Shinmei, Yoshiharu Konno, Masashi Kanoh
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Patent number: 8563362Abstract: A method for producing a semiconductor chip laminate, which comprises applying an adhesive to a substrate or other semiconductor chip; laminating the semiconductor chip on the substrate or other semiconductor chip via the adhesive; uniformly wetting and spreading the adhesive on an entire region for bonding the semiconductor chip on the substrate or other semiconductor chip; and curing the adhesive. In the application step, an area for applying adhesive is 40% to 90% of the region for bonding the semiconductor chip located on the substrate or other semiconductor chip, immediately after laminating, an area with the adhesive thereon is 60% to less than 100% of the region for bonding the semiconductor chip on the substrate or other semiconductor chip, and in wetting and spreading the adhesive, a viscosity of adhesive between the substrate or other semiconductor chips and the semiconductor chip at 0.5 rpm is 1 Pas to 30 Pas.Type: GrantFiled: March 10, 2010Date of Patent: October 22, 2013Assignee: Sekisui Chemical Co., Ltd.Inventors: Akinobu Hayakawa, Hideaki Ishizawa, Kohei Takeda, Ryohei Masui
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Publication number: 20130273378Abstract: The present invention provides an interlayer film for a laminated glass which can suppress bubble formation and bubble growth in the laminated glass. An interlayer film for a laminated glass according to the present invention includes a first layer and a second layer laminated on one face of the first layer, each of the first layer and the second layer contains a polyvinyl acetal resin, contains a carboxylic acid-modified polyvinyl acetal resin, or contains both a polyvinyl acetal resin and a carboxylic acid-modified polyvinyl acetal resin, each of the first layer and the second layer contains a plasticizer, and when the first layer does not contain the carboxylic acid-modified polyvinyl acetal resin, the first layer contains a compound having a boron atom.Type: ApplicationFiled: December 28, 2011Publication date: October 17, 2013Applicant: SEKISUI CHEMICAL CO., LTD.Inventors: Tatsuya Iwamoto, Ryousuke Komatsu, Kohei Kani, Shogo Yoshida
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Publication number: 20130273436Abstract: A lithium ion secondary battery is provided, including: a positive electrode and a negative electrode into which, and from which, lithium ions can be introduced and be discharged reversibly, and an electrolyte membrane placed therebetween, wherein the electrolyte membrane is obtained using an electrolyte made by blending (A) a polyanion type lithium salt, (B) a boron compound, and (C) an organic solvent.Type: ApplicationFiled: October 18, 2011Publication date: October 17, 2013Applicants: MIE UNIVERSITY, SEKISUI CHEMICAL CO., LTD.Inventors: Kenichi Shinmei, Masashi Kanoh, Rasika Dasanayake Aluthge, Masaru Heishi, Takahito Itoh
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Patent number: 8557394Abstract: A laminate for a laminated glass which is used as a head-up display (HUD) and is not deteriorated even if exposed to light, and with which a laminated glass having excellent impact resistance can be prepared, wherein an interlayer film for a laminated glass and a retardation element sandwiched between adhesive layers are laminated, the interlayer film for a laminated glass contains a thermoplastic resin and an ultraviolet absorber, the interlayer film for a laminated glass contains, as the ultraviolet absorber, a benzotriazole compound or a benzophenone compound, and at least one compound selected from the group consisting of a malonic ester compound, an oxanilide compound and a triazine compound.Type: GrantFiled: January 2, 2013Date of Patent: October 15, 2013Assignees: Sekisui Chemical Co., Ltd., Nippon Kayaku Kabushiki Kaisha, Polatechno Co., Ltd.Inventors: Juichi Fukatani, Izumi Omoto, Seiko Ichikawa, Kouichi Tanaka, Mayu Kameda
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Patent number: 8551602Abstract: The invention relates to a sport-technical layer for use in an artificial lawn system in particular intended for sports fields, which artificial lawn system is built up at least of a substrate to which artificial grass fibres are attached as well as the sport-technical layer extending under said substrate, which sport-technical layer comprises at least one damping sublayer made of a synthetic foam, which damping sublayer made of a synthetic foam is built up of an essentially rigid flat plate, which plate is provided with flatness-enhancing means. The invention further relates to an artificial lawn system provided with such a sport-technical layer. According to the invention, the sport-technical layer is to that end characterised in that said flatness-enhancing means comprise at least one first slot assembly of at least two closely spaced slots formed in a respective upper surface or bottom surface of the plate, which slots extend in a first direction of the plate.Type: GrantFiled: July 21, 2008Date of Patent: October 8, 2013Assignee: Sekisui Chemical Co., Ltd.Inventors: Klim Geraedts, Marinus Hendrikus Olde Weghuis, Franciscus Gerhardus Maria Kokkeler, Adrianus Lambertus Antonius Mulders
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Patent number: 8551621Abstract: The present invention provides an interlayer film for laminated glass, that exhibits an excellent sound-insulating performance for solid-borne sound in an environment at or below 0° C. Another object is to provide laminated glass that is obtained using this interlayer film for laminated glass. The present invention is an interlayer film for laminated glass, that has a sound-insulating layer for which a temperature T1, which is the temperature that gives the maximum value of tan ? at a frequency of 1 Hz, is in the range from ?30° C. to 0° C.Type: GrantFiled: September 30, 2009Date of Patent: October 8, 2013Assignee: Sekisui Chemical Co., Ltd.Inventors: Shouta Matsuda, Kozo Nakamura, Michio Shimamoto, Sinyul Yang
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Publication number: 20130247632Abstract: In an embodiment, a long reinforcing material-attached profile strip (100) in which joint portions are formed at both side edge portions and to which a reinforcing material continuously formed in the longitudinal direction is attached is supplied, and mutually adjacent joint portions are joined to each other, thereby producing a spiral pipe (S). A curl-forming apparatus (3) includes a sending roller for the reinforcing material-attached profile strip (100) and a curl guide. Using the curl-forming apparatus (3), adjacent parts of the reinforcing material-attached profile strip (100) are subjected to plastic deformation to form spirals by being provided with arc-like curls having a radius of curvature substantially similar to or not greater than the radius of curvature of the spiral pipe (S). Accordingly, the spiral pipe (S) can be produced while suppressing the action of a restoring force that restores the reinforcing material-attached profile strip (100) to its original radius of curvature.Type: ApplicationFiled: April 26, 2013Publication date: September 26, 2013Applicant: SEKISUI CHEMICAL CO., LTD.Inventors: Masashi Nakagaki, Tomonori Yamaji, Toshio Yamane
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Patent number: 8536242Abstract: The present invention provides a photocurable composition which contains a photobase generator capable of generating a satisfactory amount of a base in a high quantum yield when irradiated even with a small quantity of light for a short time, and contains a curable compound that is rapidly cured by the generated base such that the composition is cured into a cured product. The photocurable composition comprises: a photobase generator (A) which is a salt of a carboxylic acid (a1-1) represented by the following formula (1-1) with a basic compound (a2), and a curable compound (B) which has, in one molecule thereof, at least two functional groups selected from among epoxy group, (meth)acryloyl group, isocyanato group, acid anhydride group, and alkoxysilyl group, where R1 to R7 in the above formula (1-1) each are hydrogen or an organic group, R1 to R7 may be the same or different, and two of R1 to R7 may be bonded to each other to form a ring structure.Type: GrantFiled: July 23, 2008Date of Patent: September 17, 2013Assignees: Sekisui Chemical Co., Ltd., Tokyo University of Science Educational Foundation Administrative OrganizationInventors: Hiroji Fukui, Shunsuke Kondo, Koji Arimitsu
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Publication number: 20130235514Abstract: The present invention provides a crosslinked polyolefin-based resin-extruded foam sheet capable of reducing its thickness while retaining excellent flexibility and heat resistance. The crosslinked polyolefin-based resin foam sheet of the present invention is obtained by feeding a polyolefin-based resin and a thermally degradable blowing agent to an extruder, melting and kneading them, extruding the kneaded material through the extruder into a sheet to form an expandable polyolefin-based resin sheet, and expanding the sheet. Herein, a degree of crosslinking of the crosslinked polyolefin-based resin foam sheet is 5 to 60% by weight, an aspect ratio of a cell (MD average cell diameter/CD average cell diameter) is 0.25 to 1, and the polyolefin-based resin contains 40% by weight or more of a polyethylene-based resin obtained using a metallocene compound containing a tetravalent transition metal as a polymerization catalyst.Type: ApplicationFiled: April 23, 2013Publication date: September 12, 2013Applicant: Sekisui Chemical Co., Ltd.Inventors: Eiji TATEO, Koji SHIRAISHI
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Publication number: 20130236528Abstract: The present invention provides an allergen inhibitor which effectively prevents allergens from reacting with specific antibodies, mitigates the allergic symptoms or prevents appearance thereof, and is less likely to cause unpredictable discoloration and discoloration under usual conditions. The allergen inhibitor of the present invention comprises an allergen-inhibiting compound including a linear polymer having at least one of substituents represented by the formulas (1) to (3) at a side chain. Thus, the allergen inhibitor of the present invention shows excellent allergen-inhibiting effects.Type: ApplicationFiled: April 25, 2013Publication date: September 12, 2013Applicant: Sekisui Chemical Co., Ltd.Inventors: Akihiko FUJIWARA, Taro SUZUKI, Mitsuhito TERAMOTO, Taro SUZUKI, Mitsuhito TERAMOTO
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Publication number: 20130237018Abstract: An object of the present invention is to provide an adhesive for electronic components that allows suppression of occurrence of voids and is prevented from wicking up to an upper surface of a semiconductor chip. Another object of the present invention is to provide a production method for a semiconductor chip mount using the adhesive for electronic components. The present invention is an adhesive for electronic components, including a curable compound, a curing agent, and an inorganic filler, wherein A1 and A2/A1 fall within a range surrounded by solid lines and a dashed line in FIG. 1 wherein a viscosity at 5 rpm measured at 25° C. using an E type viscometer is A1 (Pa·s) and a viscosity at 0.5 rpm measured at 25° C.Type: ApplicationFiled: March 8, 2012Publication date: September 12, 2013Applicant: Sekisui Chemical Co., Ltd.Inventors: Carl Alvin Dilao, Akinobu Hayakawa, Shujiro Sadanaga, Munehiro Hatai