Abstract: The present invention provides a hot-melt coating agent that is excellent in bubble-suppression properties during coating, that is cured in a short period of time after coating, and that is excellent in tack-free properties and bleed-out resistance properties. The present invention provides a hot-melt coating agent for a component-mounted electronic circuit board that contains a thermoplastic resin (A) and a liquid softener (B); and that has a melt viscosity at 160° C. (?1) of 20000 mPa·s or less and a melt viscosity at 180° C. (?2) of 10000 mPa·s or less, wherein the ratio of the melt viscosity at 160° C. (?1) to the melt viscosity at 180° C. (?2) (?1/?2) is 1.0 to 5.0.

Abstract: The present invention provides a synthetic resin composition from which a combustion residue produced by combustion is rigid. The synthetic resin composition of the present invention is configured such that the strength of the combustion residue of the composition after combustion in an atmosphere of 800° C. for 20 minutes is 0.5 N/mm2 or more. Thus, the combustion residue produced by combustion is very rigid. The combustion residue is capable of reliably holding a state where a joint part is filled therewith and clogged even during a fire, preventing flames from passing through a sealing part such as the joint part, and imparting excellent fire-proof performance to a wall part of a building construction.

Abstract: The present invention provides a curable composition excellent in rubber elasticity, coating film strength, coatability, and adhesion to a waterproof base and the like. The curable composition of the present invention contains a polyalkylene oxide having a hydrolyzable silyl group, and feldspars having an average particle diameter of 0.01 to 100 ?m, and preferably further contains calcium carbonate. The feldspars may preferably contain nepheline syenite. The curable composition can form a cured product having excellent rubber elasticity and coating film strength, and excellent adhesion, while being low in viscosity and excellent in coatability.

Abstract: The present invention provides hot melt adhesives. A hot melt adhesive according to the present invention contains a styrenic block copolymer (A) containing a styrene-butadiene-styrene block copolymer (A1); and at least one styrenic block copolymer (A4) selected from the group consisting of a styrene-butadiene-styrene block copolymer (A2) and a styrene-isoprene-styrene block copolymer (A3), wherein the styrenic block copolymer (A) contains a predetermined amount of the styrene-butadiene-styrene block copolymer (A1) relative to the total amount of the styrene-butadiene-styrene block copolymer (A1) and the styrenic block copolymer (A4); a tackifier (B); and a plasticizer (C), wherein the hot melt adhesive has a melt viscosity of 6000 mPa s or lower.

Abstract: The present invention provides an adhesive for floor structure that can provide a floor structure inhibiting floor squeaks or joint gaps from occurring and that enables a floor finishing material to be peeled easily from a sub-floor material when repairing the floor finishing material. The adhesive for floor structure of the present invention contains a hydrolyzable silyl group-containing polyoxypropylene-based polymer (I), calcium carbonate, and a hollow filler. The adhesive for floor structure of the present invention can be used for adhesively integrating a floor finishing material 20 with a sub-floor material 30 laid on a floor base 1.

Abstract: The present invention provides an adhesive composition excellent in adhesive strength. The adhesive composition of the present invention contains 100 parts by weight of polyalkylene oxide having a hydrolyzable silyl group, 1 to 20 parts by weight of an epoxy resin, 0.1 to 10 parts by weight of an epoxysilane coupling agent, 0.5 to 20 parts by weight of a ketimine compound, and 1 to 100 parts by weight of fatty acid-treated calcium oxide.

Abstract: The present invention provides an adhesive composition excellent in adhesive strength. The adhesive composition of the present invention contains 100 parts by weight of polyalkylene oxide having a hydrolyzable silyl group, 1 to 20 parts by weight of an epoxy resin, 0.1 to 10 parts by weight of an epoxysilane coupling agent, 0.5 to 20 parts by weight of a ketimine compound, and 1 to 100 parts by weight of fatty acid-treated calcium oxide.

Abstract: A curable composition is characterized by containing a polyalkylene oxide (A) having a hydrolyzable silyl group, an acrylic polymer (B) having a hydrolyzable silyl group, and an alkoxysilane oligomer (C) which is a hydrolysis-condensation product obtained from an alkylalkoxysilane and an aminoalkoxysilane and contains nitrogen atoms in an amount of 1% by weight or more.

Abstract: The present invention provides an adhesive for floor structure that can provide a floor structure inhibiting floor squeaks or joint gaps from occurring and that enables a floor finishing material to be peeled easily from a sub-floor material when repairing the floor finishing material. The adhesive for floor structure of the present invention contains a hydrolyzable silyl group-containing polyoxypropylene-based polymer (I), calcium carbonate, and a hollow filler. The adhesive for floor structure of the present invention can be used for adhesively integrating a floor finishing material 20 with a sub-floor material 30 laid on a floor base 1.