Patents Assigned to Semblant Global Limited
  • Method for manufacturing printed circuit boards
    Patent number: 9648720
    Abstract: A method including: attaching a plurality of conductive tracks to at least one surface of a substrate, depositing a coating comprising at least one halo-hydrocarbon polymer on the at least one surface of the substrate, and soldering through the coating.
    Type: Grant
    Filed: July 22, 2013
    Date of Patent: May 9, 2017
    Assignee: Semblant Global Limited
    Inventors: Frank Ferdinandi, Rodney Edward Smith, Mark Robson Humphries
  • Apparatus with a wire bond and method of forming the same
    Patent number: 8618420
    Abstract: In some embodiments, a printed circuit board (PCB) comprises a substrate comprising an insulating material. The PCB further comprises a plurality of conductive tracks attached to at least one surface of the substrate. The PCB further comprises a multi-layer coating deposited on the at least one surface of the substrate. The multi-layer coating (i) covers at least a portion of the plurality of conductive tracks and (ii) comprises at least one layer formed of a halo-hydrocarbon polymer. The PCB further comprises at least one electrical component connected by a solder joint to at least one conductive track, wherein the solder joint is soldered through the multi-layer coating such that the solder joint abuts the multi-layer coating.
    Type: Grant
    Filed: February 18, 2011
    Date of Patent: December 31, 2013
    Assignee: Semblant Global Limited
    Inventors: Mark Robson Humphries, Frank Ferdinandi, Rodney Edward Smith
  • Printed circuit boards
    Patent number: 8492898
    Abstract: A printed circuit board to which a localised solder connection is to be made, the surface of said printed circuit board having a continuous or non-continuous coating of a composition comprising a halo-hydrocarbon polymer at a thickness of from 1 nm to 10 ?m.
    Type: Grant
    Filed: February 18, 2008
    Date of Patent: July 23, 2013
    Assignee: Semblant Global Limited
    Inventors: Frank Ferdinandi, Rodney Edward Smith, Mark Robson Humphries
  • Apparatus with a Multi-Layer Coating and Method of Forming the Same
    Publication number: 20110253429
    Abstract: In some embodiments, a printed circuit board (PCB) comprises a substrate comprising an insulating material. The PCB further comprises a plurality of conductive tracks attached to at least one surface of the substrate. The PCB further comprises a multi-layer coating deposited on the at least one surface of the substrate. The multi-layer coating (i) covers at least a portion of the plurality of conductive tracks and (ii) comprises at least one layer formed of a halo-hydrocarbon polymer. The PCB further comprises at least one electrical component connected by a solder joint to at least one conductive track, wherein the solder joint is soldered through the multi-layer coating such that the solder joint abuts the multi-layer coating.
    Type: Application
    Filed: August 11, 2009
    Publication date: October 20, 2011
    Applicant: Semblant Global Limited
    Inventors: Mark Robson Humphries, Frank Ferdinandi, Rodney Edward Smith
  • Apparatus with a Wire Bond and Method of Forming the Same
    Publication number: 20110186334
    Abstract: In some embodiments, a printed circuit board (PCB) comprises a substrate comprising an insulating material. The PCB further comprises a plurality of conductive tracks attached to at least one surface of the substrate. The PCB further comprises a multi-layer coating deposited on the at least one surface of the substrate. The multi-layer coating (i) covers at least a portion of the plurality of conductive tracks and (ii) comprises at least one layer formed of a halo-hydrocarbon polymer. The PCB further comprises at least one electrical component connected by a solder joint to at least one conductive track, wherein the solder joint is soldered through the multi-layer coating such that the solder joint abuts the multi-layer coating.
    Type: Application
    Filed: February 18, 2011
    Publication date: August 4, 2011
    Applicant: Semblant Global Limited
    Inventors: Mark Robson Humphries, Frank Ferdinandi, Rodney Edward Smith