Abstract: A probe card includes a ceramic substrate; an electrode connection part connecting an electrode pad and a via pad which are provided on one surface of the ceramic substrate; a bonding pad provided on an upper surface of the electrode pad and disposed inwardly of an edge of the electrode pad; and a probe bonded to an upper surface of the bonding pad by a solder layer between the bonding pad and the probe. The bonding pad includes a lead part protruding from a side surface of the bonding pad. As a result, overflowed solder at the time of attaching the probe onto the upper surface of the bonding pad may be dispersed to the lead part.

Abstract: A multilayer ceramic substrate includes stacked ceramic layers, and external electrodes including first conductive layers penetrating through one region of an outermost layer of the stacked ceramic layers to thereby be embedded therein, and second and third conductive layers sequentially stacked on the first conductive layers. Each of the first and second conductive layers is formed of a ceramic powder and a metal powder.

Abstract: Disclosed herein is a pre space transformer including: a substrate having a first surface and a second surface, which is an opposite surface to the first surface; individual electrodes disposed on the first surface; and common electrodes disposed in the substrate, wherein the individual electrodes are repeatedly disposed while configuring a unit pattern.

Abstract: The present invention relates to a low temperature co-fired ceramic substrate with embedded capacitors. According to an embodiment of the present invention, the low temperature co-fired ceramic substrate with embedded capacitors is able to prevent diffusion, peeling or loss of electrodes after low temperature firing by controlling composition ratio of various metals included in the substrate, resulting in good adhesion between the ceramic substrate and the capacitor.

Abstract: Disclosed herein is a pre space transformer including: a substrate having a first surface and a second surface, which is an opposite surface to the first surface; individual electrodes disposed on the first surface; and common electrodes disposed in the substrate, wherein the individual electrodes are repeatedly disposed while configuring a unit pattern.