Patents Assigned to SemCon Tech, LLC
  • Publication number: 20130189801
    Abstract: A finishing operation for a workpiece involves supplying an organic boundary lubricant to an operative finishing interface located between a finishing apparatus finishing element finishing surface and a surface of the workpiece being finished, and sensing in situ finishing information with an operative sensor. A change for a process control parameter is determined using the in situ finishing information, information from metrology equipment operatively coupled to the finishing apparatus, and information related to the finishing apparatus. An operative controller thereafter changes the process control parameter to change a processing control at least in part related to the finishing operation.
    Type: Application
    Filed: January 14, 2013
    Publication date: July 25, 2013
    Applicant: SEMCON TECH, LLC
    Inventor: SEMCON TECH, LLC
  • Patent number: 8357286
    Abstract: Versatile methods of refining a first and a second layer of a workpiece are discussed. New refining methods and refining apparatus are disclosed. The new refining methods can help improve yield and appreciably change the cost of manufacture for refining of workpieces. The methods can be applied to workpieces having extremely close tolerances such as semiconductor wafers. New methods of control are also discussed. Methods use controllers, processors, computers, and processor readable memory devices are discussed. Use of stored information is to make changes in process control are discussed. Use of process models are discussed for refining. Determining a changed process control with stored information from first and second layers of a workpiece is disclosed. A changed process control can make an appreciable changes to the cost of manufacture of a workpiece.
    Type: Grant
    Filed: October 29, 2007
    Date of Patent: January 22, 2013
    Assignee: SemCon Tech, LLC
    Inventor: Charles J. Molnar
  • Patent number: 8353738
    Abstract: Methods of using in situ finishing information for finishing workpieces and semiconductor wafers are described. Methods of using yield information at least in part related to cost of manufacture for finishing workpieces and semiconductor wafers are described. Changes or improvements to cost of manufacture of a workpiece using current in-process cost of manufacture information, tracked current in-process cost of manufacture information, or current cost of manufacture parameters are discussed. Appreciable changes to quality or cost of manufacture of a workpiece using tracking, using in-process tracked information, networks including a multiplicity of apparatus, and using in situ finishing information are discussed. A factory, apparatus, and methods to change or improve process control are discussed. A factory, apparatus, and methods to change or improve real-time process control are discussed. A factory, apparatus, and methods to change or improve feedforward and feedback control are discussed.
    Type: Grant
    Filed: August 1, 2011
    Date of Patent: January 15, 2013
    Assignee: SemCon Tech, LLC
    Inventor: Charles J. Molnar