Patents Assigned to Semi Automation & Technologies, Inc.
  • Inorganic lift-off profile process for semiconductor wafer processing
    Patent number: 10438848
    Abstract: An Inorganic Lift-Off-Profile-Process (referred to herein as “ILOPP”) is described wherein a portion of a surface inorganic oxide is etched from a substrate oxide surface and under a photoresist edge that supports a sacrificial metal layer. This oxide etched profile under the sacrificial photoresist/metal edge improves Lift-Off of the sacrificial metal layer and delivers smoother, improved metal edge definition in addition to an improved planer surface (flatness) as compared to known LOP technologies.
    Type: Grant
    Filed: October 31, 2018
    Date of Patent: October 8, 2019
    Assignee: Semi Automation & Technologies, Inc.
    Inventors: Leon Benton Pearce, Glenn Anthony Silveira