Abstract: Back-illuminated, thin photodiode arrays with trench isolation. The trenches are formed on one or both sides of a substrate, and after doping the sides of the trenches, are filled to provide electrical isolation between adjacent photodiodes. Various embodiments of the photodiode arrays and methods of forming such arrays are disclosed.

Abstract: Ultra thin back-illuminated photodiode array fabrication methods providing backside contact by diffused regions extending through the array substrate. In accordance with the methods, a matrix is diffused into one surface of a substrate, and at a later stage of the substrate processing, the substrate is reduced in thickness and a similar matrix is diffused into the substrate from the other side, this second diffusion being aligned with the first and contacting the first within the substrate. These two contacting matrices provide good electrical contact to a conductive diffusion on the backside for a low resistance contact to the backside. Various embodiments are disclosed.