Patents Assigned to SEMICOA CORPORATION
  • Hermetic Surface Mount Packages for Diodes and Transistors
    Publication number: 20130099369
    Abstract: A discrete semiconductor package includes a discrete semiconductor device disposed upon a non-conductive substrate, with via-connected upper and lower conductive ports. By utilizing a plurality of vias to connect the ports within the non-conductive substrate, and by depositing metals directly upon the surface of the substrate, manufacturing of such semiconductor packages is cheaper and more effective.
    Type: Application
    Filed: October 19, 2012
    Publication date: April 25, 2013
    Applicant: SEMICOA CORPORATION
    Inventor: Semicoa Corporation