Abstract: A semiconductor device includes a substrate having an opening extending through the substrate and at least one support member on a sidewall of the opening, a vibration membrane on the substrate, a cover layer on the vibration membrane. The substrate, the vibration membrane, and the cover layer define a cavity. The opening exposes a lower surface portion of the vibration membrane. The at least one support member on the sidewall of the opening provides support to the vibration membrane in a deformation of the vibration membrane to prevent breakage.
Type:
Grant
Filed:
February 14, 2018
Date of Patent:
July 21, 2020
Assignees:
SEMICONDUCTO MANUFACTURING INTERNATIONAL (SHANGHAI) CORPORATION, SEMICONDUCTOR MANUFACTURING INTERNATIONAL (BEIJING) CORPORATION