Abstract: A lead frame with a plurality of bump terminals is provided. Stamping an indentation into each lead in the lead frame forms the bump terminals. The bump terminals will be used as contact points in a completed semiconductor device.

Abstract: A method of forming a power supply timing controller circuit (10, 80, 90) includes forming a bi-directional synchronization oscillator controller (11, 81, 91) to oscillate at an internal frequency. The bi-directional synchronization oscillator controller (11, 81, 91) receives an external sync signal, suspends the oscillation, begins operating at the forced frequency of the external sync signal, and begins a delay period. If another external sync signal is not received before the end of the delay period, the controller resets and once again begins oscillating at the internal frequency.