Patents Assigned to Semiconductor Emergy Laboratory Co., Ltd.
  • Patent number: 9981457
    Abstract: The stack manufacturing apparatus includes a first supporting body supply unit which is configured to intermittently unroll a roll sheet-shaped first supporting body and includes one of a pair of tension applying devices capable of applying tension to the unrolled first supporting body; a first adhesive layer formation unit configured to form a first adhesive layer over the first supporting body while the first supporting body supply unit suspends unrolling of the first supporting body; a first bonding unit configured to bond the first supporting body and a sheet-shaped member using the first adhesive layer; and a control unit which is configured to hold an end portion of the first supporting body and includes the other of the pair of tension applying devices.
    Type: Grant
    Filed: September 12, 2014
    Date of Patent: May 29, 2018
    Assignee: Semiconductor Emergy Laboratory Co., Ltd.
    Inventors: Yoshiharu Hirakata, Satoshi Seo