Abstract: A ceramic semiconductor package provides for being surface mounted on a printed circuit board or other mounting surface. A ceramic frame is directly attached to a lead frame to define a cavity in which the base of a semiconductor device is mounted to the portion of the lead frame exposed at the bottom of the cavity. Interface terminals of the semiconductor device are attached to electrical contacts on the ceramic frame inside the cavity. The ceramic package provides a hermetic insulated path through which the signals can be routed from the device to the external leads. Additionally, because the semiconductor device is directly attached to the lead frame, power dissipation, i.e., heat dissipation, is more effectively provided by this direct connection without intervening layers of ceramic or conductor.