Patents Assigned to Semiconductor Ltd.
  • Power device package and method of fabricating the same
    Patent number: 7846779
    Abstract: Provided are a power device package, which can be made compact by mounting semiconductor chips in recesses formed in a substrate and improve operational reliability by rapidly dissipating heat generated during operation to the outside, and a method of fabricating the power device package.
    Type: Grant
    Filed: August 20, 2008
    Date of Patent: December 7, 2010
    Assignees: Fairchild Korea, Semiconductor Ltd.
    Inventor: Gwi-gyeon Yang