Patents Assigned to Semiconductor Manufacturing Corp.
  • Method of forming via
    Patent number: 6245667
    Abstract: A method of forming a via. A stacked structure has a barrier layer and a metal line is formed over a substrate. Spacers capable of serving as a barrier are formed over tapering sidewalls of the stacked structure before vias and plugs are formed.
    Type: Grant
    Filed: December 17, 1999
    Date of Patent: June 12, 2001
    Assignee: Semiconductor Manufacturing Corp.
    Inventors: Ling-Sung Wang, Chingfu Lin, Chien-Jung Wang