Abstract: A secondary battery in which convection in an electrolyte solution occurs easily is provided. A secondary battery whose electrolyte solution can be replaced is provided. A nonaqueous secondary battery includes a positive electrode, a negative electrode, a separator, and an electrolyte solution, and the separator includes grooves capable of making convection in the electrolyte solution occur easily. The nonaqueous secondary battery has at least one expected installation direction, and the grooves in the separator are preferably formed so as to be perpendicular to an expected installation surface. The exterior body includes a first opening for injection of an inert gas into the exterior body and a second opening for expelling or injection of an electrolyte solution from or into the exterior body. An electrolyte solution replacement apparatus has a function of injecting the inert gas through the first opening and expelling or injecting the electrolyte solution through the second opening.

Abstract: A semiconductor substrate is formed into a regular hexagon or a shape similar to the regular hexagon. The semiconductor substrate is bonded to and separated from a large-area substrate. Moreover, layout is designed so that a boundary of bonded semiconductors is located in a region which is removed by etching when patterning is performed by photolithography or the like.

Abstract: To provide a semiconductor device in which a defect or fault is not generated and a manufacturing method thereof even if a ZnO semiconductor film is used and a ZnO film to which an n-type or p-type impurity is added is used for a source electrode and a drain electrode. The semiconductor device includes a gate insulating film formed by using a silicon oxide film or a silicon oxynitride film over a gate electrode, an Al film or an Al alloy film over the gate insulating film, a ZnO film to which an n-type or p-type impurity is added over the Al film or the Al alloy film, and a ZnO semiconductor film over the ZnO film to which an n-type or p-type impurity is added and the gate insulating film.

Abstract: A thin-film transistor includes a pair of impurity semiconductor layers in which an impurity element imparting one conductivity type is added to form a source and drain regions so as to be overlapped at least partly with a gate electrode with a gate insulating layer interposed between the gate electrode and the impurity semiconductor layers; a pair of conductive layers which is overlapped over the gate insulating layers at least partly with the gate electrode and the impurity semiconductor layers, and is disposed with a space therebetween in a channel length direction; and an amorphous semiconductor layer which is in contact with the gate insulating layer and the pair of conductive layers and is extended between the pair of conductive layers.

Abstract: A technique capable of efficient, high speed processing for the formation of an organic compound layer by using an ink jet method is provided. In the method of forming an organic compound layer by using the ink jet method, a composition containing an organic compound having light emitting characteristics is discharged from an ink head, forming a continuous organic compound layer. The organic compound layer is formed on pixel electrodes aligned in a matrix shape, and is formed in a continuous manner over a plurality of pixel electrodes. A light emitting device is manufactured using organic light emitting elements in accordance with this manufacturing method.

Abstract: A laser beam irradiation method that achieves uniform crystallization, even if a film thickness of an a-Si film or the like fluctuates, is provided. The present invention provides a laser beam irradiation method in which a non-single crystal semiconductor film is formed on a substrate having an insulating surface and a laser beam having a wavelength longer than 350 nm is irradiated to the non-single crystal semiconductor film, thus crystallizing the non-single crystal silicon film. The non-single crystal semiconductor film has a film thickness distribution within the surface of the substrate, and a differential coefficient of a laser beam absorptivity with respect to the film thickness of the non-single crystal semiconductor film is positive.

Abstract: A light-emitting compound that can be easily applied to vacuum vapor deposition and exhibit long wavelength light is disclosed. Further, a light-emitting element without inferior luminescence properties due to the carbonization of a light-emitting compound during vapor deposition; and a light-emitting device that is composed of the light-emitting elements are also disclosed. A pyran derivative is represented by the following general formula 1: wherein R1 is a hydrogen element or an alkoxy group.

Abstract: A thin film semiconductor device comprising a substrate having an insulating surface, gate electrodes disposed on the insulating surface, gate insulating films disposed on upper portions of the gate electrodes, and thin film semiconductors disposed on the gate insulating films and including channel forming regions, source regions and drain regions. Two kinds of thin film semiconductor unit are disposed on the substrate. A first thin film semiconductor unit includes the thin film semiconductor of polycrystal, an insulating film covering an upper portion of the channel forming region, impurity semiconductor films doped with trivalent or pentavalent impurities and covering the source region and the drain region, and conductive films disposed on the impurity semiconductor films. A second thin film semiconductor unit includes the thin film semiconductor of amorphous, and other components similar to the first thin film semiconductor unit.

Abstract: A method for manufacturing a semiconductor, comprising crystallizing an amorphous silicon film formed on a substrate by employing lateral growth method using a catalyst element which accelerates the crystallization, wherein the duration of annealing accounts for 90% or more but less than 100% of the time for crystallization of the amorphous silicon film under the condition that no catalyst element is used.

Abstract: In a solar cell including a photoelectric conversion layer 14 disposed on a flexible substrate 11 and constituted by a laminated layer of non-single crystalline silicon thin films, the flexible substrate 11 has a coefficient of linear thermal expansion of is 2.0 ppm to 10.0 ppm. By this, the coefficient of linear thermal expansion of the flexible substrate 11 and that of the photoelectric conversion layer 14 become close to each other, so that warp and deformation during manufacturing steps and after the steps are decreased. Further, since stress applied to the photoelectric conversion layer 14 is also lessened, the photoelectric conversion efficiency can be increased.

Abstract: A liquid crystal display device including (a) a plurality of source lines over a substrate; (b) a plurality of gate lines over the substrate in an orthogonal relation to the plurality of the source lines; and (c) a plurality of pixels in a matrix array at intersections of the source lines and gate lines, wherein, (i) each of the pixels is formed over the substrate and includes, at least a thin film transistor having a channel region, source and drain regions, a gate insulator adjacent to the channel region, and a gate electrode adjacent to the gate insulating film; (ii) a pixel electrode connected to the thin film transistor, (iii) a storage capacitor operationally connected to the thin film transistor, the storage capacitor including an insulating film and at least first and second electrodes with the insulating film interposed therebetween, and (iv) wherein the first electrode may comprise the same semiconductor material as the channel region, and/or at least the channel region of the in film transistor may

Abstract: An amorphous semiconductor film is etched so that a width of a narrowest portion thereof is 100 .mu.m or less, thereby forming island semiconductor regions. By irradiating an intense light such as a laser into the island semiconductor regions, photo-annealing is performed to crystallize it. Then, of end portions (peripheral portions) of the island semiconductor regions, at least a portion used to form a channel of a thin film transistor (TFT), or a portion that a gate electrode crosses is etched, so that a region that the distortion is accumulated is removed. By using such semiconductor regions, a TFT is produced.

Abstract: In a vapor phase apparatus such as a plasma chemical vapor deposition (CVD) having a pair of electrodes, a surface of one of the electrodes has an uneven shape (concave portion and convex portion). An interval between the electrodes is 10 mm or less. A density of a convex portion is increased in a center portion of the electrode. An aspect ratio of the uneven shape is increased from a peripheral portion of the electrode to a center portion of the electrode. The aspect ratio represents a ratio (b/a) of a pitch (a) and a height (b) of the convex portion.