Patents Assigned to Semicontect Corp
  • Method and apparatus for chemical mechanical polishing
    Patent number: 6315641
    Abstract: Method and apparatus for chemically mechanically polishing semiconductor substrates with enhanced durability, reliability and polishing effectiveness. In the method of the present invention, the substrate and the pad respectively orbits to guarantee uniform polishing across the substrate in principle. The apparatus of the present invention employing the above method is mechanically stable to enhance process reliability.
    Type: Grant
    Filed: March 24, 2000
    Date of Patent: November 13, 2001
    Assignees: Semicontect Corp, Genitech Co., Ltd.
    Inventors: Kyu Hong Lee, Yong Byouk Lee, Sang Won Kang