Abstract: The inventive concept relates to a substrate cooling apparatus for cooling a substrate. The substrate cooling apparatus includes a chuck on which the substrate is placed and a cooling unit that cools the chuck. The cooling unit includes a heat dissipation plate that has the chuck placed on an upper surface thereof and that dissipates heat of the chuck.

Abstract: Disclosed is an apparatus for applying a force to a partial area of a substrate. The substrate pressing module includes a support member configured to support the substrate, a weight member provided to be positioned on the partial area of the substrate positioned on the support member and having a specific weight or more, and a pressing unit configured to apply a force to the weight member from the upper side.

Abstract: Provided are a device packing facility and method using DEHT and a device processing apparatus utilizing the DEHT. The device packaging facility includes a mounting unit providing bis(2-ethylhexyl) terephthalate (DEHT) between first and second devices to attach the first and second devices to each other, a processing unit thermally processing the first and second devices that are attached to each other to remove the DEHT and fix the first and second devices to each other, and a transfer unit transferring the first and second devices that are attached to each other from the mounting unit to the processing unit.

Abstract: The inventive concept relates to a substrate cooling apparatus for cooling a substrate. The substrate cooling apparatus includes a chuck on which the substrate is placed and a cooling unit that cools the chuck. The cooling unit includes a heat dissipation plate that has the chuck placed on an upper surface thereof and that dissipates heat of the chuck.

Abstract: Disclosed is an apparatus for supporting a substrate. The substrate support unit includes a support plate having a plurality of absorption holes, in which a vacuum pressure is formed, on an upper surface thereof to absorb the substrate, and a vacuum absorption unit configured to apply the vacuum pressure to the absorption holes, and the vacuum absorption unit includes a pressure measuring member configured to measure internal pressures of the absorption holes, an intake unit configured to intake and discharge gas in the absorption holes and adjust a suction force for suctioning the gas in the absorption holes, and a controller configured to control the intake unit to adjust the suction force according to the internal pressures measured by the pressure measuring member.

Abstract: Disclosed is an alignment apparatus that aligns a treatment object having a notch. The alignment apparatus includes a support member on which the treatment object is positioned, a driving unit configured to rotate the support member, a pushing member configured to move the treatment object to a proper location on the support member by applying a force to a side surface of the treatment object positioned on the support member, a notch detecting unit configured to detect whether the notch of the treatment object is located at a specific location, and a controller configured to control the driving unit such that the notch of the treatment object is located at the specific location by rotating the support member.

Abstract: Disclosed is an alignment apparatus that aligns a treatment object having a notch. The alignment apparatus includes a support member on which the treatment object is positioned, a driving unit configured to rotate the support member, a pushing member configured to move the treatment object to a proper location on the support member by applying a force to a side surface of the treatment object positioned on the support member, a notch detecting unit configured to detect whether the notch of the treatment object is located at a specific location, and a controller configured to control the driving unit such that the notch of the treatment object is located at the specific location by rotating the support member.

Abstract: Disclosed is an apparatus for applying a force to a partial area of a substrate. The substrate pressing module includes a support member configured to support the substrate, a weight member provided to be positioned on the partial area of the substrate positioned on the support member and having a specific weight or more, and a pressing unit configured to apply a force to the weight member from the upper side.

Abstract: Disclosed is an apparatus for supporting a substrate. The substrate support unit includes a support plate having a plurality of absorption holes, in which a vacuum pressure is formed, on an upper surface thereof to absorb the substrate, and a vacuum absorption unit configured to apply the vacuum pressure to the absorption holes, and the vacuum absorption unit includes a pressure measuring member configured to measure internal pressures of the absorption holes, an intake unit configured to intake and discharge gas in the absorption holes and adjust a suction force for suctioning the gas in the absorption holes, and a controller configured to control the intake unit to adjust the suction force according to the internal pressures measured by the pressure measuring member.

Abstract: Provided are a device packing facility and method using DEHT and a device processing apparatus utilizing the DEHT. The device packaging facility includes a mounting unit providing bis(2-ethylhexyl) terephthalate (DEHT) between first and second devices to attach the first and second devices to each other, a processing unit thermally processing the first and second devices that are attached to each other to remove the DEHT and fix the first and second devices to each other, and a transfer unit transferring the first and second devices that are attached to each other from the mounting unit to the processing unit.

Abstract: Provided are a device packing facility and method using DEHT and a device processing apparatus utilizing the DEHT. The device packaging facility includes a mounting unit providing bis(2-ethylhexyl) terephthalate (DEHT) between first and second devices to attach the first and second devices to each other, a processing unit thermally processing the first and second devices that are attached to each other to remove the DEHT and fix the first and second devices to each other, and a transfer unit transferring the first and second devices that are attached to each other from the mounting unit to the processing unit.

Abstract: Provided are a device packing facility and method using DEHT and a device processing apparatus utilizing the DEHT. The device packaging facility includes a mounting unit providing bis(2-ethylhexyl) terephthalate (DEHT) between first and second devices to attach the first and second devices to each other, a processing unit thermally processing the first and second devices that are attached to each other to remove the DEHT and fix the first and second devices to each other, and a transfer unit transferring the first and second devices that are attached to each other from the mounting unit to the processing unit.

Abstract: Provided are a device packing facility and method using phthalate and a device processing apparatus utilizing the phthalate. The device packaging facility includes a mounting unit providing phthalate between first and second devices to attach the first and second devices to each other, a processing unit thermally processing the first and second devices that are attached to each other to remove the phthalate and fix the first and second devices to each other, and a transfer unit transferring the first and second devices that are attached to each other from the mounting unit to the processing unit.

Abstract: Provided are a semiconductor substrate manufacturing apparatus and a substrate treating method, and more particularly, an apparatus and method for performing a reflow treating process on a semiconductor wafer. The apparatus treating apparatus includes a load port on which a carrier accommodating a substrate is seated, a substrate treating module including one reflow treating unit or a plurality of reflow treating units for performing a reflow process on the substrate, and a substrate transfer module including a transfer robot transferring the substrate between the load port and the substrate treating module, the substrate transfer module being disposed between the load port and the substrate treating module. The reflow treating unit includes a process chamber having a treating space therein and an exhaust member exhausting a fluid within the process chamber.

Abstract: Provided are a semiconductor substrate manufacturing apparatus and a substrate treating method, and more particularly, an apparatus and method for performing a reflow treating process on a semiconductor wafer. The apparatus treating apparatus includes a load port on which a carrier accommodating a substrate is seated, a substrate treating module including one reflow treating unit or a plurality of reflow treating units for performing a reflow process on the substrate, and a substrate transfer module including a transfer robot transferring the substrate between the load port and the substrate treating module, the substrate transfer module being disposed between the load port and the substrate treating module. The reflow treating unit includes a process chamber having a treating space therein and an exhaust member exhausting a fluid within the process chamber.

Abstract: Provided are a device packing facility and method using DEHT and a device processing apparatus utilizing the DEHT. The device packaging facility includes a mounting unit providing bis(2-ethylhexyl) terephthalate (DEHT) between first and second devices to attach the first and second devices to each other, a processing unit thermally processing the first and second devices that are attached to each other to remove the DEHT and fix the first and second devices to each other, and a transfer unit transferring the first and second devices that are attached to each other from the mounting unit to the processing unit.

Abstract: Provided are a device packing facility and method using phthalate and a device processing apparatus utilizing the phthalate. The device packaging facility includes a mounting unit providing phthalate between first and second devices to attach the first and second devices to each other, a processing unit thermally processing the first and second devices that are attached to each other to remove the phthalate and fix the first and second devices to each other, and a transfer unit transferring the first and second devices that are attached to each other from the mounting unit to the processing unit.

Abstract: Provided are a semiconductor substrate manufacturing apparatus and a substrate treating method, and more particularly, an apparatus and method for performing a reflow treating process on a semiconductor wafer. The apparatus treating apparatus includes a load port on which a carrier accommodating a substrate is seated, a substrate treating module including one reflow treating unit or a plurality of reflow treating units for performing a reflow process on the substrate, and a substrate transfer module including a transfer robot transferring the substrate between the load port and the substrate treating module, the substrate transfer module being disposed between the load port and the substrate treating module. The reflow treating unit includes a process chamber having a treating space therein and an exhaust member exhausting a fluid within the process chamber.

Abstract: Provided are a semiconductor substrate manufacturing apparatus and a substrate treating method, and more particularly, an apparatus and method for performing a reflow treating process on a semiconductor wafer. The apparatus treating apparatus includes a load port on which a carrier accommodating a substrate is seated, a substrate treating module including one reflow treating unit or a plurality of reflow treating units for performing a reflow process on the substrate, and a substrate transfer module including a transfer robot transferring the substrate between the load port and the substrate treating module, the substrate transfer module being disposed between the load port and the substrate treating module. The reflow treating unit includes a process chamber having a treating space therein and an exhaust member exhausting a fluid within the process chamber.

Abstract: Provided are a semiconductor substrate manufacturing apparatus and a substrate treating method, and more particularly, an apparatus and method for performing a reflow treating process on a semiconductor wafer. The apparatus treating apparatus includes a load port on which a carrier accommodating a substrate is seated, a substrate treating module including one reflow treating unit or a plurality of reflow treating units for performing a reflow process on the substrate, and a substrate transfer module including a transfer robot transferring the substrate between the load port and the substrate treating module, the substrate transfer module being disposed between the load port and the substrate treating module. The reflow treating unit includes a process chamber having a treating space therein and an exhaust member exhausting a fluid within the process chamber.