Patents Assigned to Semitechnologies Llimited
  • Patent number: 9919916
    Abstract: A method of forming microneedles where through a series of coating and etching processes microneedles are formed from a surface as an array. The microneedles have a bevelled end and bore which are formed as part of the process with no need to use a post manufacturing process to finish the microneedle.
    Type: Grant
    Filed: October 15, 2014
    Date of Patent: March 20, 2018
    Assignee: Semitechnologies Llimited
    Inventors: Yufei Lui, Owen Guy