Abstract: A method for accurately depositing a required volume of solder material on a specific area of a lead frame, substrate or other part of an electronic component to be bonded by reflow of solder material to another part into a reliable, void-free connection during a subsequent assembly step comprises the following steps. Minute particles of solder material whose cumulative volume corresponds to the total volume to be deposited are loaded into a cavity cut into a fixture made from a material such as graphite. The cavity delineates the specific area of deposit. The part is then laid upon the fixture and immobilized thereon by a cover made from a material such as graphite. The fixture and its enclosed part are then subjected to solder material melting temperature under a controlled atmosphere in a furnace. The cavity is patterned and dimensioned to accommodate the right number of uniformly dimensioned particles necessary to precisely create the desired deposit of solder material.

Abstract: A tension-regulated wire-feeding apparatus, particularly adapted to high speed winding of thin conductor wires upon an electronic component, applies a magnetic particle brake to the wire supply spool in inverse proportion to the pulling tension applied on the wire by the winding mechanism. The brake is controlled by an electric current generated by a controllable power supply. The output of the power supply is modulated by a follower potentiometer coupled to a lever arm which resiliently bear against a segment of wire unwound from the supply spool in order to monitor its pulling tension.