Patents Assigned to Sendo International, Limited
  • Patent number: 6900544
    Abstract: An integrated circuit package device (100, 200, 300) has a plurality of contact points including an inner portion of contact points (120) and an outer portion of contact points (110). The integrated circuit package device includes at least one of the following: (i) one or more power supply contacts (130) configured substantially in said outer portion; (ii) one or more ground contacts (220, 230) configured substantially in said inner portion; (iii) one or more timing or frequency contacts (140) substantially in said outer portion; (iv) one or more data or high speed signal contacts (310) configured substantially in said outer portion of said integrated circuit package device. This provides the advantage that the required capacitors can be located as close to the power supply contact as possible, and the tracking to these contacts can be kept to a minimum.
    Type: Grant
    Filed: September 9, 2003
    Date of Patent: May 31, 2005
    Assignee: Sendo International, Limited
    Inventor: Olivier Boireau
  • Publication number: 20040113257
    Abstract: An integrated circuit package device (100, 200, 300) has a plurality of contact points including an inner portion of contact points (120) and an outer portion of contact points (110). The integrated circuit package device includes at least one of the following: (i) one or more power supply contacts (130) configured substantially in said outer portion; (ii) one or more ground contacts (220, 230) configured substantially in said inner portion; (iii) one or more timing or frequency contacts (140) substantially in said outer portion; (iv) one or more data or high speed signal contacts (310) configured substantially in said outer portion of said integrated circuit package device. This provides the advantage that the required capacitors can be located as close to the power supply contacts as possible, and the tracking to these contacts can be kept to a minimum.
    Type: Application
    Filed: September 9, 2003
    Publication date: June 17, 2004
    Applicant: SENDO INTERNATIONAL LIMITED
    Inventor: Olvier Boireau
  • Patent number: 6734555
    Abstract: An integrated circuit package device (100, 200, 300) has a plurality of contact points including an inner portion of contact points (120) and an outer portion of contact points (110). The integrated circuit package device includes at least one of the following: (i) one or more power supply contacts (130) configured substantially in said outer portion; (ii) one or more ground contacts (220, 230) configured substantially in said inner portion; (iii) one or more timing or frequency contacts (140) substantially in said outer portion; (iv) one or more data or high speed signal contacts (310) configured substantially in said outer portion of said integrated circuit package device. This provides the advantage that the required capacitors can be located as close to the power supply contacts as possible, and the tracking to these contacts can be kept to a minimum.
    Type: Grant
    Filed: September 10, 2002
    Date of Patent: May 11, 2004
    Assignee: Sendo International Limited
    Inventor: Olivier Boireau
  • Publication number: 20040001701
    Abstract: A method of recording a broadcast signal includes accessing a host server by an intermediary communication unit. The host server includes a database of broadcast program information. The method includes selecting one or more program(s) from the database, using said intermediary communication unit transmitting information relating to a selected program from the host server to the intermediary communication unit, where the programming information is extracted. At least one control signal is generated and transmitted from the intermediary communication unit to a broadcast signal recorder to set the recorder to record the selected broadcast program. As all the user is required to do is to select a required broadcast program, for example a broadcast television program, from a list, the likelihood of the user entering information or commands incorrectly is greatly reduced. Furthermore, the user does not necessarily need to obtain and enter any codes relating to such information.
    Type: Application
    Filed: May 16, 2003
    Publication date: January 1, 2004
    Applicant: Sendo International Limited
    Inventor: Michael Roper
  • Publication number: 20030224768
    Abstract: A method of handling a re-start of a first processor in a dual-processor system where the system includes a first processor performing a first set of functions operably coupled to a second processor performing a second set of functions. The method includes the steps of storing one or more initialization and/or configuration commands in a memory element, wherein the commands are sent by the second processor to the first processor to set an operation of said first processor. A message from the first processor indicates a re-start operation of the first processor, in response to which the one or more initialization or configuration commands are retrieved from the memory element. The first processor is then re-started with preferably the most-recent initialization or configuration setting so that the operational state of the first processor, following re-start, is as expected by the second processor.
    Type: Application
    Filed: May 23, 2003
    Publication date: December 4, 2003
    Applicant: SENDO INTERNATIONAL LIMITED
    Inventor: Regis Adjamah
  • Publication number: 20030148759
    Abstract: A wireless communication network (222) transmits (232) operation enabling and/or inhibiting information to a wireless communication unit (100, 210). In response to the information, a processor (108) of the wireless communication unit (100, 210) selectively enables or inhibits transmission and/or reception of wireless signals to and/or from the at least one wireless communication unit (100, 210) in a frequency band selected from a plurality of selectable multi-band frequencies or a signal format selected from a plurality of selectable multi-formatted signal types. This provides the advantage that an operation of a communication unit with respect to frequency bands or signal formats can be configured and re-configured, even after the communication unit has been sold to an end user. Such a reconfiguration can be at the request of the end user, or alternatively can be performed independently by the network operator or manufacturer of the communication unit.
    Type: Application
    Filed: January 30, 2003
    Publication date: August 7, 2003
    Applicant: SENDO INTERNATIONAL LIMITED
    Inventor: Thomas Leliveld
  • Publication number: 20030100274
    Abstract: A wireless headset-based communication arrangement (200, 300) comprises a first subscriber unit (210), a wireless headset (212) associated with the first subscriber unit (210) to form a wireless communication apparatus; and a detector within the wireless communication apparatus to detect a spatial proximity of at least one second subscriber unit (220) or second wireless headset (222). In response to the detection, the wireless headset (212) associated with the first subscriber unit (210) is adapted to communicate directly (230) with the at least one second subscriber unit (220) or second wireless headset (222). One advantage of the present invention is that the functionality of a hands-free headset and the functionality of inter-headset communication are combined into a single headset apparatus.
    Type: Application
    Filed: November 27, 2002
    Publication date: May 29, 2003
    Applicant: Sendo International Limited
    Inventor: Andrew Philip Brown
  • Publication number: 20030047349
    Abstract: An integrated circuit package device (100, 200, 300) has a plurality of contact points including an inner portion of contact points (120) and an outer portion of contact points (110). The integrated circuit package device includes at least one of the following: (i) one or more power supply contacts (130) configured substantially in said outer portion; (ii) one or more ground contacts (220, 230) configured substantially in said inner portion; (iii) one or more timing or frequency contacts (140) substantially in said outer portion; (iv) one or more data or high speed signal contacts (310) configured substantially in said outer portion of said integrated circuit package device. This provides the advantage that the required capacitors can be located as close to the power supply contacts as possible, and the tracking to these contacts can be kept to a minimum.
    Type: Application
    Filed: September 10, 2002
    Publication date: March 13, 2003
    Applicant: Sendo International Limited
    Inventor: Olivier Boireau
  • Patent number: D451079
    Type: Grant
    Filed: November 27, 2000
    Date of Patent: November 27, 2001
    Assignee: Sendo International Limited
    Inventor: Adil Ali
  • Patent number: D495671
    Type: Grant
    Filed: August 19, 2003
    Date of Patent: September 7, 2004
    Assignee: Sendo International Limited
    Inventor: Donna Piacenza