Patents Assigned to Sendo International, Limited
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Patent number: 6900544Abstract: An integrated circuit package device (100, 200, 300) has a plurality of contact points including an inner portion of contact points (120) and an outer portion of contact points (110). The integrated circuit package device includes at least one of the following: (i) one or more power supply contacts (130) configured substantially in said outer portion; (ii) one or more ground contacts (220, 230) configured substantially in said inner portion; (iii) one or more timing or frequency contacts (140) substantially in said outer portion; (iv) one or more data or high speed signal contacts (310) configured substantially in said outer portion of said integrated circuit package device. This provides the advantage that the required capacitors can be located as close to the power supply contact as possible, and the tracking to these contacts can be kept to a minimum.Type: GrantFiled: September 9, 2003Date of Patent: May 31, 2005Assignee: Sendo International, LimitedInventor: Olivier Boireau
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Publication number: 20040113257Abstract: An integrated circuit package device (100, 200, 300) has a plurality of contact points including an inner portion of contact points (120) and an outer portion of contact points (110). The integrated circuit package device includes at least one of the following: (i) one or more power supply contacts (130) configured substantially in said outer portion; (ii) one or more ground contacts (220, 230) configured substantially in said inner portion; (iii) one or more timing or frequency contacts (140) substantially in said outer portion; (iv) one or more data or high speed signal contacts (310) configured substantially in said outer portion of said integrated circuit package device. This provides the advantage that the required capacitors can be located as close to the power supply contacts as possible, and the tracking to these contacts can be kept to a minimum.Type: ApplicationFiled: September 9, 2003Publication date: June 17, 2004Applicant: SENDO INTERNATIONAL LIMITEDInventor: Olvier Boireau
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Patent number: 6734555Abstract: An integrated circuit package device (100, 200, 300) has a plurality of contact points including an inner portion of contact points (120) and an outer portion of contact points (110). The integrated circuit package device includes at least one of the following: (i) one or more power supply contacts (130) configured substantially in said outer portion; (ii) one or more ground contacts (220, 230) configured substantially in said inner portion; (iii) one or more timing or frequency contacts (140) substantially in said outer portion; (iv) one or more data or high speed signal contacts (310) configured substantially in said outer portion of said integrated circuit package device. This provides the advantage that the required capacitors can be located as close to the power supply contacts as possible, and the tracking to these contacts can be kept to a minimum.Type: GrantFiled: September 10, 2002Date of Patent: May 11, 2004Assignee: Sendo International LimitedInventor: Olivier Boireau
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Publication number: 20040001701Abstract: A method of recording a broadcast signal includes accessing a host server by an intermediary communication unit. The host server includes a database of broadcast program information. The method includes selecting one or more program(s) from the database, using said intermediary communication unit transmitting information relating to a selected program from the host server to the intermediary communication unit, where the programming information is extracted. At least one control signal is generated and transmitted from the intermediary communication unit to a broadcast signal recorder to set the recorder to record the selected broadcast program. As all the user is required to do is to select a required broadcast program, for example a broadcast television program, from a list, the likelihood of the user entering information or commands incorrectly is greatly reduced. Furthermore, the user does not necessarily need to obtain and enter any codes relating to such information.Type: ApplicationFiled: May 16, 2003Publication date: January 1, 2004Applicant: Sendo International LimitedInventor: Michael Roper
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Publication number: 20030224768Abstract: A method of handling a re-start of a first processor in a dual-processor system where the system includes a first processor performing a first set of functions operably coupled to a second processor performing a second set of functions. The method includes the steps of storing one or more initialization and/or configuration commands in a memory element, wherein the commands are sent by the second processor to the first processor to set an operation of said first processor. A message from the first processor indicates a re-start operation of the first processor, in response to which the one or more initialization or configuration commands are retrieved from the memory element. The first processor is then re-started with preferably the most-recent initialization or configuration setting so that the operational state of the first processor, following re-start, is as expected by the second processor.Type: ApplicationFiled: May 23, 2003Publication date: December 4, 2003Applicant: SENDO INTERNATIONAL LIMITEDInventor: Regis Adjamah
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Publication number: 20030148759Abstract: A wireless communication network (222) transmits (232) operation enabling and/or inhibiting information to a wireless communication unit (100, 210). In response to the information, a processor (108) of the wireless communication unit (100, 210) selectively enables or inhibits transmission and/or reception of wireless signals to and/or from the at least one wireless communication unit (100, 210) in a frequency band selected from a plurality of selectable multi-band frequencies or a signal format selected from a plurality of selectable multi-formatted signal types. This provides the advantage that an operation of a communication unit with respect to frequency bands or signal formats can be configured and re-configured, even after the communication unit has been sold to an end user. Such a reconfiguration can be at the request of the end user, or alternatively can be performed independently by the network operator or manufacturer of the communication unit.Type: ApplicationFiled: January 30, 2003Publication date: August 7, 2003Applicant: SENDO INTERNATIONAL LIMITEDInventor: Thomas Leliveld
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Publication number: 20030100274Abstract: A wireless headset-based communication arrangement (200, 300) comprises a first subscriber unit (210), a wireless headset (212) associated with the first subscriber unit (210) to form a wireless communication apparatus; and a detector within the wireless communication apparatus to detect a spatial proximity of at least one second subscriber unit (220) or second wireless headset (222). In response to the detection, the wireless headset (212) associated with the first subscriber unit (210) is adapted to communicate directly (230) with the at least one second subscriber unit (220) or second wireless headset (222). One advantage of the present invention is that the functionality of a hands-free headset and the functionality of inter-headset communication are combined into a single headset apparatus.Type: ApplicationFiled: November 27, 2002Publication date: May 29, 2003Applicant: Sendo International LimitedInventor: Andrew Philip Brown
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Publication number: 20030047349Abstract: An integrated circuit package device (100, 200, 300) has a plurality of contact points including an inner portion of contact points (120) and an outer portion of contact points (110). The integrated circuit package device includes at least one of the following: (i) one or more power supply contacts (130) configured substantially in said outer portion; (ii) one or more ground contacts (220, 230) configured substantially in said inner portion; (iii) one or more timing or frequency contacts (140) substantially in said outer portion; (iv) one or more data or high speed signal contacts (310) configured substantially in said outer portion of said integrated circuit package device. This provides the advantage that the required capacitors can be located as close to the power supply contacts as possible, and the tracking to these contacts can be kept to a minimum.Type: ApplicationFiled: September 10, 2002Publication date: March 13, 2003Applicant: Sendo International LimitedInventor: Olivier Boireau
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Patent number: D451079Type: GrantFiled: November 27, 2000Date of Patent: November 27, 2001Assignee: Sendo International LimitedInventor: Adil Ali
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Patent number: D495671Type: GrantFiled: August 19, 2003Date of Patent: September 7, 2004Assignee: Sendo International LimitedInventor: Donna Piacenza