Patents Assigned to Senjo Seiki Corporation
  • Patent number: 7008311
    Abstract: A lapping tool capable of increasing the accuracy of a lapping operation, extending the life of lapping tool itself, adjusting a lapping diameter, and coping with the lapping operation of various diameters, comprising a lapping tool body having a lapping part on the outer peripheral surface thereof and slits provided in the lapping tool body axially between the tip part and the base part thereof.
    Type: Grant
    Filed: January 16, 2002
    Date of Patent: March 7, 2006
    Assignee: Senjo Seiki Corporation
    Inventor: Motohiro Senjo
  • Patent number: 6027288
    Abstract: A working apparatus comprising, a base, a work piece supporting and rotating means on the base to hold and rotate a work piece, a working tool unit on the base to hold a working tool to be rotatable and which forwardly and rearwardly moves in horizontal direction toward the work piece via a slider mechanism, a pressing means to press the working tool unit in horizontal direction at a constant pressing force toward the work piece, and a profiling means on the working tool unit to forwardly and rearwardly move by profiling an outer periphery of the work piece through being in contact with the work piece in horizontal direction and thereby to move the whole working tool unit in forward and rearward directions.
    Type: Grant
    Filed: January 6, 1998
    Date of Patent: February 22, 2000
    Assignee: Senjo Seiki Corporation
    Inventor: Motohiro Senjo