Patents Assigned to Senseics Corporation
  • Patent number: 11770635
    Abstract: An integrated circuit (IC) includes an analog to digital converter (ADC) circuit having an ADC input and an ADC output. The ADC circuit is configured to receive an input signal at the ADC input and generate a digital output signal at the ADC output based on the input signal. An ADC circuit path is coupled between the ADC input and the ADC output. The ADC circuit comprises a plurality of capacitors coupled between reference voltage sources and the ADC circuit path. The ADC has a reconfigurable resolution and a reconfigurable sampling rate. The ADC circuit is configured to scale the reference voltage sources and/or the plurality of capacitors based on the reconfigurable resolution.
    Type: Grant
    Filed: January 30, 2023
    Date of Patent: September 26, 2023
    Assignee: Senseics Corporation
    Inventor: Ramy S. Tantawy
  • Patent number: 11570392
    Abstract: An imager device includes a pixel sensor configured to receive and convert incident radiation into a pixel signal and a readout circuit configured to receive the pixel signal from the pixel sensor, generate a received signal strength indicator (RSSI) value based on the pixel signal, and generate a digital signal based on the RSSI value and the pixel signal.
    Type: Grant
    Filed: May 29, 2020
    Date of Patent: January 31, 2023
    Assignee: Senseics Corporation
    Inventor: Ramy Tantawy