Patents Assigned to Sensible Holding B.V.
  • Method and arrangement for assembly of microchips into a separate substrate
    Patent number: 12515947
    Abstract: A method for assembling one or more microchips into respective holes in a substrate surface of a separate receiving substrate for microchip insertion that is out-of-plane in relation to the substrate surface. The microchips are placed on the substrate surface and moved by one or more magnetic fields affecting a ferromagnetic layer of each microchip so that the microchips become out-of-plane oriented in relation to the substrate surface and are assembled into the holes.
    Type: Grant
    Filed: September 10, 2020
    Date of Patent: January 6, 2026
    Assignee: Sensible Holding B.V.
    Inventors: Federico Ribet, Miku Brodin-Laakso, Simone Pagliano, Frank Niklaus, Niclas Roxhed, Göran Stemme