Patents Assigned to Sensonor A/S
  • Sealed cavity arrangement method
    Patent number: 5591679
    Abstract: This invention relates to a method for making sealed cavities on silicon wafer surfaces by anodic bonding and with electrically insulated conductors through the sealing areas to connect functional devices inside the cavities to electrical terminals outside said cavities. Said conductors are provided by the use of doped buried crossings in a single crystal silicon substrate, thereby also allowing different kinds of integrated silicon devices, e.g. sensors to be made. Further, the invention relates to a device made by the novel method.
    Type: Grant
    Filed: January 30, 1996
    Date of Patent: January 7, 1997
    Assignee: Sensonor A/S
    Inventors: Henrik Jakobsen, Terje Kvister.o slashed.y