Patents Assigned to Sensor, Inc.
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Patent number: 7539003Abstract: The devices presented herein are capacitive sensors with single crystal silicon on all key stress points. Isolating trenches are formed by trench and refill forming dielectrically isolated conductive silicon electrodes for drive, sense and guards. For pressure sensing devices according to the invention, the pressure port is opposed to the electrical wire bond pads for ease of packaging. Dual-axis accelerometers measuring in plane acceleration and out of plane acceleration are also described. A third axis in plane is easy to achieve by duplicating and rotating the accelerometer 90 degrees about its out of plane axis Creating resonant structures, angular rate sensors, bolometers, and many other structures are possible with this process technology. Key advantages are hermeticity, vertical vias, vertical and horizontal gap capability, single crystal materials, wafer level packaging, small size, high performance and low cost.Type: GrantFiled: February 16, 2007Date of Patent: May 26, 2009Assignee: LV Sensors, Inc.Inventors: Curtis A. Ray, Janusz Bryzek
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Patent number: 7533575Abstract: Magnetic or electric field sensors are mounted against a material surface and used for stress, strain, and load monitoring of rotating components such as vehicle drive trains. The stationary sensors are mounted at multiple locations around the component and used assess the stress on the component at multiple rotational positions. The sensor response is typically converted into a material property, such as magnetic permeability or electrical conductivity, which accounts for any coating thickness that may be present between the sensor and mounting surface. The sensors are not in direct contact with the rotating component and are typically mounted on an annular material or ring that encircles the rotating component. Measurements of the annular material properties, such as the stress, are related to the stress on the rotating component and discrete features on the component.Type: GrantFiled: February 5, 2007Date of Patent: May 19, 2009Assignee: JENTEK Sensors, Inc.Inventors: Neil J. Goldfine, Darrell E. Schlicker, David C. Grundy, Yanko K. Sheiretov, Leandro M. Lorilla, Vladimir A. Zilberstein, Volker Weiss, J. Timothy Lovett, Andrew P. Washabaugh
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Patent number: 7528598Abstract: Damage and usage conditions in the vicinity of fasteners in joined structures are nondestructively evaluated using the fasteners themselves. Sensors or sensor conductors are embedded in the fasteners or integrated within the fastener construct, either in the clearance gap between the fastener and the structure material or as an insert inside the shaft or pin of the fastener. The response of the material to an interrogating magnetic or electric field is then measured with drive and sense electrodes both incorporated into the fastener or with either drive or sense electrodes external to the fastener on the material surface. In another configuration, an electric current is applied to one or more fasteners and the electric potential is measured at locations typically between the driven electrodes applying the current. The potential is measured circumferentially around the fastener at locations on the material surface or across pairs of fasteners throughout or along the joint.Type: GrantFiled: June 22, 2006Date of Patent: May 5, 2009Assignee: JENTEK Sensors, Inc.Inventors: Neil J. Goldfine, David C. Grundy, Andrew P. Washabaugh, Yanko K. Sheiretov, Darrell E. Schlicker
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Patent number: 7526964Abstract: Methods are described for the use of conformable eddy-current sensors and sensor arrays for characterizing residual stresses and applied loads in materials. In addition, for magnetizable materials such as steels, these methods can be used to determine carbide content and to inspect for grinding burn damage. The sensor arrays can be mounted inside or scanned across the inner surface of test articles and hollow fasteners to monitor stress distributions. A technique for placing eddy-current coils around magnetizable fasteners for load distribution monitoring is also disclosed.Type: GrantFiled: January 24, 2003Date of Patent: May 5, 2009Assignee: JENTEK Sensors, Inc.Inventors: Neil J. Goldfine, Vladimir A. Zilberstein, James M. Fisher, David C. Grundy, Darrell E. Schlicker, Vladimir Tsukernik, Robert J. Lyons, Ian C. Shay, Andrew P. Washabaugh
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Patent number: 7521945Abstract: An embodiment of the present invention provides for a sensing element comprising a non-conductive housing with three chambers for detecting oil conductivity, additive depletion and oxidation, and water contamination, respectively. Through the monitoring of an array of oil sensors, an early warning of oil degradation due to oxidation is provided. The monitoring system further detects excess soot, water and other contaminants in the oil. The oil sensor array and related monitoring system decrease the likelihood of catastrophic engine failure through the early detection and warning of a decrease in oil quality thereby reducing vehicle owner outlays for servicing and disposal fees while further aiding in the satisfaction of environmental protection regulations.Type: GrantFiled: February 20, 2007Date of Patent: April 21, 2009Assignee: Voelker Sensors Inc.Inventors: Joe D. Hedges, Paul J. Voelker
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Patent number: 7518360Abstract: Combined wound and micro-fabricated winding constructs are described for the inspection of materials and the detection and characterization of hidden features or flaws. These constructs can be configured as sensors or sensor arrays that are surface mounted or scanned over conducting and/or magnetizable test materials. The well-defined geometry obtained micro-fabricated windings and from carefully wound coils with known winding positions permits the use of model based inversions of sensed responses into material properties. In a preferred embodiment, the primary winding is a wound coil and the sense elements are etched or printed. The drive or sense windings can also be mounted under fasteners to improve sensitivity to hidden flaws. Ferrites and other means may be used to guide the magnetic flux and enhance the magnetic field in the test material.Type: GrantFiled: June 1, 2007Date of Patent: April 14, 2009Assignee: JENTEK Sensors, Inc.Inventors: Neil J. Goldfine, Darrell E. Schlicker, Andrew P. Washabaugh, Ian C. Shav, Mark D. Windoloski, Christopher Root, Vladimir A. Zilberstein, David C. Grundy, Vladimir Tsukernik
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Patent number: 7518493Abstract: The present invention provides a tire pressure sensor system that has multiple functions and is integrated into a small package. The system includes one or more Micro Electro Mechanical System (MEMS)-based sensors, including a MEMS-based pressure sensor; a MEMS-oscillator-based wireless signal transmitter; and a microcontroller, where the microcontroller processes the data generated by at least one of the MEMS-based sensors, controls at least one of the MEMS-based sensors, and controls the encoding and timing of transmission of data from the wireless signal transmitter. Preferably, the MEMS-based sensors, MEMS-oscillator-based wireless signal transmitter, and microcontroller are integrated onto one or more chips in one or more packages. The system also preferably includes a MEMS-based motion sensor, a low frequency (LF) receiver, an IC-based voltage sensor, a voltage regulator, a temperature sensor and a polarization voltage generator.Type: GrantFiled: December 1, 2005Date of Patent: April 14, 2009Assignee: LV Sensors, Inc.Inventors: Janusz Bryzek, Curtis Ray, Brian Lee Bircumshaw, Elizabeth A. Logan
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Patent number: 7514228Abstract: The invention relates to novel methods and compositions for the detection of analytes using the nuclear reorganization energy, ?, of an electron transfer process.Type: GrantFiled: August 2, 2007Date of Patent: April 7, 2009Assignee: Clinical Micro Sensors, Inc.Inventor: Thomas J. Meade
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Patent number: 7502148Abstract: A multi-lightguide document imaging device is proposed for scanning a document transported atop it. The device includes a line image sensor module having a top sensing area and built-in circuitry for converting an incident line image into video signal output; an intervening rod lens for focusing line image lights from the document onto the sensing area; a number or lightguides lightguide-j (j=1,2, . . . ,N) disposed below the document where each lightguide-j has its own built-in light sources, a transverse cross section spaced at a distance SPCj from the scan line an oriented angularly along a ?-coordinate so as to project a line-illumination aiming at the scan line; and an imager frame having a base for holding the line image sensor module, a multi-element support for holding the rod lens plus the lightguides and a scan line backing portion for backing the document.Type: GrantFiled: February 16, 2007Date of Patent: March 10, 2009Assignee: CMOS Sensor, Inc.Inventor: Weng-Lyang Wang
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Publication number: 20090057147Abstract: The invention is directed to devices that allow for simultaneous multiple biochip analysis. In particular, the devices are configured to hold multiple cartridges comprising biochips comprising arrays such as nucleic acid arrays, and allow for high throughput analysis of samples.Type: ApplicationFiled: October 31, 2007Publication date: March 5, 2009Applicant: Clinical Micro Sensors, Inc.Inventor: Jon Faiz Kayyem
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Publication number: 20090001974Abstract: An apparatus for the nondestructive measurement of materials that includes at least two layers of electrical conductors. Within each layer, a meandering primary winding is used to create a magnetic field for interrogating a test material while sense elements or conducting loops within each meander provide a directional measurement of the test material condition. In successive layers extended portions of the meanders are rotated so that the sense elements provide material condition in different orientations without requiring movement of the test circuit or apparatus. In a bidirectional implementation the angle is 90° while in a quadridirectional implementation the relative angles are ?45, 0, 45, and 90°. Multidirectional permeability measurements are used to assess the stress or torque on a component. These measurements are combined in a manner that removes temperature effects and hysteresis on the property measurements.Type: ApplicationFiled: June 12, 2008Publication date: January 1, 2009Applicant: JENTEK Sensors, Inc.Inventors: Yanko K. Sheiretov, Neil J. Goldfine, Todd M. Dunford, Scott A. Denenberg, David C. Grundy, Darrell E. Schlicker, Andrew P. Washabaugh, Karen E. Walrath
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Patent number: 7470966Abstract: The present invention is directed towards radiation detectors and methods of detecting incident radiation. In particular the present invention is directed towards photodiodes with controlled current leakage detector structures and a method of manufacturing photodiodes with controlled current leakage detector structures. The photodiodes of the present invention are advantageous in that they have special structures to substantially reduce detection of stray light. Additionally, the present invention gives special emphasis to the design, fabrication, and use of photodiodes with controlled leakage current.Type: GrantFiled: July 6, 2007Date of Patent: December 30, 2008Assignee: UDT Sensors, Inc.Inventors: Peter Steven Bui, Narayan Dass Taneja
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Patent number: 7468556Abstract: Improved sensor packaging is provided with a hybrid integration approach. In one example, an application specific integrated circuit (ASIC) for sensor signal conditioning is packaged. The ASIC package has an aperture in it that exposes a chip to chip bonding interface of the ASIC chip. The rest of the ASIC chip is surrounded by the package, including the connections between the external package leads and the ASIC chip. A sensor chip, also having a chip to chip bonding interface, is disposed in the package aperture and bonded to the ASIC chip such that the two chip to chip bonding interfaces are connected. Flip chip bonding of the sensor chip to the ASIC chip is a preferred approach for chip to chip bonding. The vertical gap between the two chips can be filled in by an underfill process. The lateral gap between the sensor chip and the package can also be filled.Type: GrantFiled: June 18, 2007Date of Patent: December 23, 2008Assignee: LV Sensors, Inc.Inventors: Elizabeth A. Logan, Curtis A. Ray
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Patent number: 7467057Abstract: Precomputed databases of sensor responses are used to convert measurement data into properties of interest, for example, conductivity or lift-off. These databases of responses may be generated prior to data acquisition and provide sensor response values that span appropriate ranges for the property values. After data acquisition, estimates for the property values are obtained from measurement values by minimizing the difference between the database of responses and the measurement values. The minimization can take the form of a least-squares minimization. Alternatively, iterative techniques can be used to minimize the difference between the database and measurement values.Type: GrantFiled: September 15, 2005Date of Patent: December 16, 2008Assignee: JENTEK Sensors, Inc.Inventors: Yanko Konstantinov Sheiretov, Neil J. Goldfine, Andrew P. Washabaugh, Darrell E. Schlicker
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Patent number: 7463756Abstract: A finger position sensing apparatus, typically used in a fingerprint sensing system, includes a position pickup plate disposed generally orthogonally with respect to an expected direction of movement of a finger and a plurality of position drive plates having different spacings from the position pickup plate to define plurality of position sensor gaps between respective position drive plates and the position pickup plate. The position drive plates are dimensioned and spaced from the position pickup plate to sense the bulk of a finger rather than fingerprint features.Type: GrantFiled: April 15, 2005Date of Patent: December 9, 2008Assignee: Validity Sensors, Inc.Inventor: Fred G. Benkley, III
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Patent number: 7460697Abstract: Image sensing apparatus includes an image pickup plate disposed generally orthogonally with respect to an expected direction of movement of an object, such as a finger, multiple image drive plates in spaced relation to the image pickup plate to define sensor gaps between respective image drive plates and the image pickup plate, and a reference plate disposed substantially parallel to the image pickup plate. The reference plate is spaced from the image pickup plate to permit common mode noise and coupling to be cancelled and is spaced from the image drive plates to permit a differential image signal to develop between the image pickup plate and the reference plate. A differential amplifier coupled to the image pickup plate and the reference plate provides noise cancellation. The apparatus may further include a comb plate spaced from the reference plate and coupled to a reference potential, such as ground.Type: GrantFiled: July 19, 2005Date of Patent: December 2, 2008Assignee: Validity Sensors, Inc.Inventors: Richard A. Erhart, Darioush Keyvani, Fred G. Benkley, III, Jaswinder Jandu
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Patent number: 7454967Abstract: A tire pressure monitoring system is provided that includes a switched capacitor circuit having a clock with two non-overlapping clock phases that control a state of analog switches of the switched capacitor circuit. The system uses tire pressure sensor MEMS capacitors that are measured differentially. A capacitance-to-voltage converter is connected to the MEMS sense capacitor, and a sigma-delta converter having a comparator with a first digital output state and a second digital output state is used. The first output state is a sum of reference voltages and the second output state is a difference of the reference voltages. An average value of the capacitance-to-voltage converter output is driven to a zero value and a digital output is provided of the average output states that is equal to a difference between the MEMS capacitors divided by their sum multiplied by a ratio of the reference voltages.Type: GrantFiled: July 9, 2007Date of Patent: November 25, 2008Assignee: LV Sensors, Inc.Inventor: David Skurnik
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Patent number: 7451657Abstract: Methods are described for assessing material condition. These methods include the use of multiple source fields for interrogating and loading of a multicomponent test material. Source fields include electric, magnetic, thermal, and acoustic fields. The loading field preferentially changes the material properties of a component of the test material, which allows the properties of the component materials to be separated. Methods are also described for monitoring changes in material state using separate drive and sense electrodes with some of the electrodes positioned on a hidden or even embedded material surface. Statistical characterization of the material condition is performed with sensor arrays that provide multiple responses for the material condition during loading. The responses can be combined into a statistical population that permits tracking with respect to loading history.Type: GrantFiled: January 14, 2005Date of Patent: November 18, 2008Assignee: JENTEK Sensors, Inc.Inventors: Neil J. Goldfine, Darrell E. Schlicker, Vladimir A. Zilberstein, Andrew P. Washabaugh, Volker Weiss, Christopher A. Craven, Ian C. Shay, David C. Grundy, Karen E. Walrath, Robert J. Lyons
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Patent number: 7451639Abstract: A set of curved components, such as the dovetail region of engine blades, are inspected by mounting each component into a circular carousel in a vertical orientation and rotating the carousel to move each component toward and away from an inspection site. The inspection site clamps a flexible eddy current sensor array to the curved material surface, scans the array over the surface, records the sensor position. A rigid element having a surface geometry similar to the surface shape of the component can be attached to the component to facilitate scanning of the sensor array over a component edge. The response of each sense element in the array may be converted into an effective material property and sense element proximity to the component material surface to verify the quality of the inspection scan and the presence of a defect such as a crack.Type: GrantFiled: March 7, 2007Date of Patent: November 18, 2008Assignee: JENTEK Sensors, Inc.Inventors: Neil J Goldfine, Mark D Windoloski, Vladimir B Tsukernik, Darrell E Schlicker, Todd M Dunford, Andrew P. Washabaugh
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Patent number: 7451659Abstract: A gap-change sensing through capacitive techniques is disclosed. In one embodiment, an apparatus includes a first conductive surface and a second conductive surface substantially parallel to the first conductive surface, and a sensor to generate a measurement based on a change in a distance between the first conductive surface and the second conductive surface. The change in the distance may be caused by a deflection of the first conductive surface with respect to the second conductive surface, and the deflection may be a compressive force and/or an expansive force. The sensor may apply an algorithm that converts a change in capacitance to at least one of a change in voltage and/or a change in frequency to generate the measurement. The change in the distance may be caused by a load applied to the surface above the first conductive surface with respect to the second conductive surface.Type: GrantFiled: September 28, 2005Date of Patent: November 18, 2008Assignee: Loadstar Sensors, Inc.Inventors: William D. Dallenbach, Divyasimha Harish