Patents Assigned to Sensor Technology Co., Ltd.
  • Patent number: 11843154
    Abstract: A balun assembly is provided. The balun assembly includes a first substrate having first and second surfaces opposite to each other, a first transmission electrode on the first surface of the first substrate, a ground electrode having an opening therein and on a side of the first substrate distal to the first transmission electrode, a first dielectric layer on a side of the ground electrode distal to the first substrate, and second and third transmission electrodes both on a side of the first dielectric layer distal to the ground electrode, the second and third transmission electrodes being spaced apart from each other. Orthographic projections of the first, second and third transmission electrodes on the first substrate intersect with an orthographic projection of the opening on the first substrate at first, second and third intersection points, respectively, and the first intersection point is between the second and third intersection points.
    Type: Grant
    Filed: September 25, 2020
    Date of Patent: December 12, 2023
    Assignees: BEIJING BOE SENSOR TECHNOLOGY CO., LTD., BOE TECHNOLOGY GROUP CO., LTD.
    Inventors: Haocheng Jia, Tienlun Ting, Ying Wang, Jie Wu, Liang Li, Cuiwei Tang, Qiangqiang Li, Wei Zhang, Chuncheng Che
  • Patent number: 11837802
    Abstract: A liquid crystal antenna unit and a liquid crystal phased array antenna are provided. The liquid crystal antenna unit includes: a first substrate, a second substrate opposite to the first substrate, a liquid crystal layer between the first substrate and the second substrate, a transmission line on a first surface and extending in a first direction along the first surface, a first antenna oscillator on the first surface and arranged as an elongated dipole extending in a second direction along the first surface, a second antenna oscillator on a surface of the second substrate distal to the first substrate and at a position corresponding to the first antenna oscillator, and a ground electrode on a surface of the first substrate distal to the second substrate.
    Type: Grant
    Filed: September 26, 2019
    Date of Patent: December 5, 2023
    Assignees: BEIJING BOE SENSOR TECHNOLOGY CO., LTD., BOE TECHNOLOGY GROUP CO., LTD.
    Inventors: Jie Wu, Tienlun Ting, Xiangzhong Kong, Xue Cao, Ying Wang, Liang Li, Haocheng Jia, Peizhi Cai, Chuncheng Che
  • Patent number: 11837796
    Abstract: A feeding structure is provided that includes a reference electrode, first and second substrates opposite to each other, and a dielectric layer between the first and second substrates. The first substrate includes a first base plate and an input electrode on a side of the first base plate proximal to the dielectric layer. The second substrate includes a second base plate and a receiving electrode on a side of the second base plate proximal to the dielectric layer, and orthographic projections of the receiving electrode and the input electrode on the first base plate at least partially overlaps each other to form a coupling structure. An output terminal of the input electrode or the receiving electrode is connected to a phase shifting structure to differ a phase of a microwave signal transmitted via the first substrate from a phase of a microwave signal transmitted via the second substrate.
    Type: Grant
    Filed: August 27, 2020
    Date of Patent: December 5, 2023
    Assignees: BEIJING BOE SENSOR TECHNOLOGY CO., LTD., BOE TECHNOLOGY GROUP CO., LTD.
    Inventors: Haocheng Jia, Tienlun Ting, Ying Wang, Jie Wu, Liang Li, Cuiwei Tang, Qiangqiang Li, Chuncheng Che
  • Patent number: 11839008
    Abstract: The present disclosure provides a smart window and a driving method thereof and a smart window system. The smart window includes a glass module, a first controller, at least one light bar group and a light bar monitoring circuit. The glass module is coupled to the first controller; the at least one light bar group is coupled to the first controller; and the light bar monitoring circuit includes at least one light bar monitoring sub-circuit. The at least one light bar monitoring sub-circuit is coupled to the first controller and is coupled in a one-to-one correspondence to the at least one light bar group.
    Type: Grant
    Filed: April 28, 2021
    Date of Patent: December 5, 2023
    Assignees: Beijing BOE Sensor Technology Co., Ltd., BOE TECHNOLOGY GROUP CO., LTD.
    Inventors: Yongbo Wang, Chen Meng, Yiping Ruan, Shaobo Han, Siheng Xu, Zhong Hu, Kai Yu
  • Patent number: 11830278
    Abstract: An optical sensor array substrate and an optical fingerprint reader are provided. The optical sensor array substrate includes a substrate including a detection area which includes a plurality of photosensitive pixels. Photosensitive pixel includes: a TFT arranged on the substrate; a storage capacitor arranged on the substrate and having a first capacitor plate, and a second capacitor plate electrically connected to the source or drain of the TFT; a photosensitive element located on one side of the storage capacitor away from the substrate, and having one end electrically connected to the second capacitor plate; a first electrode layer located on one side of the photosensitive element away from the substrate and electrically connected to another end of the photosensitive element. An orthographic projection of the second capacitor plate on the substrate at least partially overlaps with an orthographic projection of the first electrode layer on the substrate.
    Type: Grant
    Filed: November 30, 2020
    Date of Patent: November 28, 2023
    Assignees: Beijing BOE Sensor Technology Co., Ltd., BOE Technology Group Co., Ltd.
    Inventors: Yajie Feng, Cheng Li, Yue Geng, Kuiyuan Wang, Zefei Li, Chaoyang Qi, Yi Dai, Xiaoguan Li, Yingzi Wang
  • Patent number: 11828965
    Abstract: The present disclosure provides a dimming substrate, a manufacturing method of the dimming substrate, a dimming structure and a dimming module, and relates to the technical field of display. According to the present disclosure, a bonding layer, a flexible base plate, an electrode layer and an orientation layer are sequentially arranged on a rigid carrier plate, and the bonding layer includes one or more adhesive layers. By removing flexible base films from the bonding layer, the bonding layer only includes one or more adhesive layers, such that the dimming substrate includes less flexible base films.
    Type: Grant
    Filed: September 23, 2021
    Date of Patent: November 28, 2023
    Assignees: Beijing BOE Sensor Technology Co., Ltd., BOE Technology Group Co., Ltd.
    Inventors: Changyin Wang, Juan Chen, Peng Liang, Chunlei Wang, Jing Yu
  • Publication number: 20230378100
    Abstract: A detection substrate and manufacturing method thereof, a flat panel detector and manufacturing method thereof. The detection substrate includes: a substrate including a detection region, a binding region, a controllable on-off region, and a cutting region; a plurality of detection units including transistors and photosensitive devices located in the detection region, a transistor includes a gate, a first electrode and a second electrode; a photosensitive device is connected to the first or second electrode; a plurality of conductive wires, one end is connected to the gate, and the other end is extended to the binding region; a conductive ring disposed in the cutting region; a plurality of detection wires, one end is connected to the conductive ring, the other end is connected to the conductive wires, the detection wires are passed through the controllable on-off region; the detection wires located in the controllable on-off region can have a disconnected state.
    Type: Application
    Filed: March 24, 2021
    Publication date: November 23, 2023
    Applicants: Beijing BOE Sensor Technology Co., Ltd., BOE TECHNOLOGY GROUP CO., LTD.
    Inventors: Bin ZHAO, Shuai XU, Binbin XU, Xuecheng HOU, Jinyu LI, Ye ZHANG, Chuncheng CHE
  • Patent number: 11822024
    Abstract: Provided is a pixel sensing circuit, including a signal generation sub-circuit, a reset sub-circuit, an amplification sub-circuit, and a read sub-circuit. The reset sub-circuit is configured to provide a signal of a first power supply line to a first node under control of a reset signal line. The signal generation sub-circuit is configured to detect a light signal and convert the detected light signal into an electrical signal. The amplification sub-circuit is configured to provide an amplified electrical signal to a second node according to a signal provided by a second power supply line and under control of the first node. The read sub-circuit is configured to output the amplified electrical signal to a signal read line under control of a scan signal line.
    Type: Grant
    Filed: August 31, 2021
    Date of Patent: November 21, 2023
    Assignees: Beijing BOE Sensor Technology Co., Ltd., BOE Technology Group Co., Ltd.
    Inventors: Dexi Kong, Cheng Li, Kunjing Chung, Lin Zhou, Jingjie Su, Jie Zhang, Tiansheng Li, Ziran Liu, Jin Cheng
  • Patent number: 11811121
    Abstract: A phase shifter, a manufacture method for manufacturing a phase shifter, a drive method for driving a phase shifter, and an electronic device are provided. The phase shifter includes a dielectric substrate, and a transmission line, a dielectric layer, an insulating layer, and a metal layer on the dielectric substrate. In a direction perpendicular to a first surface of the dielectric substrate, the dielectric layer and the insulating layer are between the metal layer and the transmission line, a material of the dielectric layer is a semiconductor material; and an orthographic projection of the metal layer on the dielectric substrate, an orthographic projection of the insulating layer on the dielectric substrate, and an orthographic projection of the dielectric layer on the dielectric substrate at least partially overlap. The present disclosure provides a new phase shifter based on a metal-insulator-semiconductor capacitor structure.
    Type: Grant
    Filed: November 29, 2019
    Date of Patent: November 7, 2023
    Assignees: Beijing BOE Sensor Technology Co., Ltd., BOE Technology Group Co., Ltd.
    Inventors: Cuiwei Tang, Tienlun Ting, Xue Cao, Jie Wu, Ying Wang, Liang Li, Haocheng Jia, Chuncheng Che
  • Patent number: 11764170
    Abstract: A sensing substrate and an electronic device are provided. The sensing substrate includes a sensing unit on a base substrate. The sensing unit includes a sensing element and a conductive pattern, the sensing element has a light incident surface and a back surface that are opposite and a side surface between the light incident surface and the back surface. The conductive pattern is on a side of the sensing element away from the base substrate, and has a hollow portion and a transparent conductive portion surrounding the hollow portion, an orthographic projection of the hollow portion on the base substrate is at least partially within an orthographic projection of the sensing element on the base substrate, and an orthographic projection of the transparent conductive portion on the base substrate at least partially overlaps with an orthographic projection of the side surface of the sensing element on the base substrate.
    Type: Grant
    Filed: July 7, 2021
    Date of Patent: September 19, 2023
    Assignees: BEIJING BOE SENSOR TECHNOLOGY CO., LTD., BOE TECHNOLOGY GROUP CO., LTD.
    Inventors: Guan Zhang, Jianxing Shang, Huinan Xia, Bin Zhao
  • Patent number: 11747666
    Abstract: A windowing device includes: a windowing module including a dimming transparent substrate and a semiconductor temperature adjustment element, the dimming transparent substrate being provided with different light transmittances when the dimming transparent substrate has different adjustment parameters; a temperature adjustment circuitry configured to input a current to the semiconductor temperature adjustment element and adjust a temperature of the semiconductor temperature adjustment element; a temperature sensor configured to detect a temperature of an environment where the windowing module is located; and a controller configured to input a circuitry adjustment signal to the temperature adjustment circuitry when the temperature detected by the temperature sensor is beyond a predetermined temperature range, as to adjust a temperature of the dimming transparent substrate to be within the predetermined temperature range.
    Type: Grant
    Filed: March 26, 2021
    Date of Patent: September 5, 2023
    Assignees: BEIJING BOE SENSOR TECHNOLOGY CO., LTD., BOE TECHNOLOGY GROUP CO., LTD.
    Inventors: Yongbo Wang, Jing Yu, Chen Meng, Wei Sun, Zhong Hu, Dahai Hu
  • Patent number: 11731125
    Abstract: A patterning method of a film is disclosed. The method including: providing a film including a first surface; forming n etching barrier layers on the first surface of the film, and n is an integer larger than or equal to 2; and performing n etching processes on the film to form a recessed structure on the first surface using the n etching barrier layers as masks, the recessed structure includes n bottom surfaces respectively having different depths. Two adjacent etching processes of the n etching processes include a previous etching process and a subsequent etching process, and after the previous etching process is completed, a part of the n etching barrier layers is removed to form a mask for the subsequent etching process; a material of the part of the n etching barrier layers which is removed is different from a material of the mask of the subsequent etching process.
    Type: Grant
    Filed: January 3, 2019
    Date of Patent: August 22, 2023
    Assignees: BEIJING BOE SENSOR TECHNOLOGY CO., LTD., BOE TECHNOLOGY GROUP CO., LTD.
    Inventors: Yue Geng, Yuelei Xiao, Hui Liao, Peizhi Cai, Jian Li, Shenkang Wu
  • Patent number: 11698543
    Abstract: The present disclosure discloses a dimming method for a dimming glass, including: in response to a dimming level selected from a user, obtaining a light transmittance value corresponding to the selected dimming level according to a corresponding relationship between dimming levels and actual light transmittance of the dimming glass; obtaining a dimming voltage value corresponding to the light transmittance value according to a corresponding relationship between the actual light transmittance and dimming voltages of the dimming glass; and adjusting a voltage applied to the dimming glass to the obtained dimming voltage value, wherein the corresponding relationship between the dimming levels and the actual light transmittance of the dimming glass is dividing an adjustable range of the actual light transmittance of the dimming glass to obtain the actual light transmittance corresponding to different dimming levels. The present disclosure improves dimming effect of dimming glass.
    Type: Grant
    Filed: February 22, 2021
    Date of Patent: July 11, 2023
    Assignees: Beijing BOE Sensor Technology Co., Ltd., BOE Technology Group Co., Ltd.
    Inventors: Guo Liu, Chen Meng, Zhong Hu, Jiarong Liu, Qinhao Piao, Yutao Tang, Xiantao Liu, Binbin Liu
  • Patent number: 11699772
    Abstract: Disclosed are an array substrate and a preparation method thereof, and a digital microfluidic chip. The preparation method includes: forming a plurality of photoelectric detection devices on a silicon-based substrate; transferring the photoelectric detection devices to a base substrate by adopting a micro transfer printing process; and forming a plurality of transparent driving electrodes on the base substrate, wherein the transparent driving electrodes are insulated from the photoelectric detection devices.
    Type: Grant
    Filed: March 19, 2020
    Date of Patent: July 11, 2023
    Assignees: Beijing BOE Sensor Technology Co., Ltd., BOE Technology Group Co., Ltd.
    Inventors: Xue Dong, Yue Geng, Peizhi Cai
  • Patent number: 11688942
    Abstract: The present disclosure provides an antenna, an antenna device, a fabricating method of the antenna, and a fabricating method of the antenna device, and relates to the field of antenna technology. The antenna includes a first substrate; a base material layer on the first substrate and having a plurality of antenna cavities arranged in an array therein; and a conductive layer on an inner side of each of the plurality of antenna cavities, each of the plurality of antenna cavities and the conductive layer on the inner side thereof forming an antenna unit, wherein each of the plurality of antenna cavities includes a first opening, and an aperture of the first opening at a position of the antenna cavity close to the first substrate is smaller than an aperture of the first opening at a position of the antenna cavity away from the first substrate.
    Type: Grant
    Filed: September 7, 2021
    Date of Patent: June 27, 2023
    Assignees: BEIJING BOE SENSOR TECHNOLOGY CO., LTD., BOE TECHNOLOGY GROUP CO., LTD.
    Inventors: Ying Wang, Tienlun Ting, Jie Wu, Haocheng Jia, Liang Li, Cuiwei Tang, Qiangqiang Li, Wei Zhang, Meng Wei, Hao Liu, Chuncheng Che
  • Publication number: 20230184602
    Abstract: A thin-film pressure sensor and an arrangement method thereof are provided. The thin-film pressure sensor includes a flat diaphragm and a first induction unit in the shape of a thin film arranged on the flat diaphragm, where the first induction unit includes m rotating multi-segment resistance wires arranged around the center of a circle of a circular deformation area of the flat diaphragm, m/2 rotating multi-segment resistance wires on one side are connected in series to form a second induction resistor, and m/2 rotating multi-segment resistance wires on the other side are connected in series to form a fourth induction resistor, where m is a multiple of 4; the arrangement method includes arrangement for the first induction unit. The radial strain and the tangential strain of the flat diaphragm can be fully utilized, and the detection sensitivity of the thin-film pressure sensor is improved.
    Type: Application
    Filed: January 29, 2021
    Publication date: June 15, 2023
    Applicant: HUNAN CHNTEK SENSOR TECHNOLOGY CO., LTD.
    Inventors: Guoqiu WANG, Jian HUANG, Cui CHEN
  • Publication number: 20230168135
    Abstract: A distributed fiber temperature measurement device includes a temperature measurement module and temperature measurement fibers. The temperature measurement fiber includes alternately arranged sensing and isolation fibers. The sensing fibers are coiled in a fiber clamp holder to constitute temperature measurement sensing surfaces of temperature measurement points. The isolation fibers are coiled on a back side of the fiber clamp holder to constitute an isolation fiber storage region. A distance between the adjacent temperature measurement points is adjusted by releasing and storing the isolation fibers in the isolation fiber storage region. The temperature measurement module is connected to the temperature measurement fibers to obtain temperature measurement points temperatures. An environment temperature of a fiber clamp holder accessory corresponding to the isolation fibers is measured by the isolation fibers, and the sensing fibers of the adjacent measurement points are isolated by isolation fibers.
    Type: Application
    Filed: December 22, 2021
    Publication date: June 1, 2023
    Applicants: SHANDONG MICRO-SENSOR PHOTONICS LIMITED, GUANGDONG LASER SENSOR TECHNOLOGY CO. LTD.
    Inventors: Tongyu LIU, Tao JIANG, Yanong NING, Zhidong SHI, Guangxian JIN, Zhenya LIU
  • Patent number: 11637369
    Abstract: The present disclosure provides a signal conditioner, an antenna device and a manufacturing method. The signal conditioner includes: a microstrip line including a first portion and a second portion; an insulating layer including a first insulating layer covering the first portion; at least one electrode; a liquid crystal layer covering the microstrip line, the insulating layer, and the at least one electrode; and a common electrode line. A first end of the first portion is connected to a first end of the second portion. A second end of the first portion is connected to a second end of the second portion. The at least one electrode includes a first electrode on a side of the first insulating layer facing away from the first portion. The common electrode line is on a side of the liquid crystal layer facing away from the microstrip line.
    Type: Grant
    Filed: August 10, 2022
    Date of Patent: April 25, 2023
    Assignees: Beijing BOE Sensor Technology Co., Ltd., BOE Technology Group Co., Ltd.
    Inventors: Jie Wu, Tienlun Ting, Xiangzhong Kong, Liang Li, Xue Cao, Ying Wang, Haocheng Jia, Peizhi Cai, Chuncheng Che
  • Patent number: D1000976
    Type: Grant
    Filed: December 29, 2021
    Date of Patent: October 10, 2023
    Assignee: GUILIN GEMRED SENSOR TECHNOLOGY CO., LTD.
    Inventors: Ye Chen, Yue Wu, Jinhua Lan, Xiamei Wen, Wenai Li
  • Patent number: D1005861
    Type: Grant
    Filed: December 29, 2021
    Date of Patent: November 28, 2023
    Assignee: GUILIN GEMRED SENSOR TECHNOLOGY CO., LTD.
    Inventors: Fenghu Huang, Quanfeng Mo, Yue Wu, Guanglu Yang, Jinhua Lan, Xiamei Wen, Wenai Li, Hui Lu